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Senior Packaging Engineer

Metamagnetics, Inc.
Marlborough, MA

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Job Details

Full-time
$140,000 - $170,000 a year
11 days ago

Benefits

AD&D insurance
Disability insurance
Relocation assistance
Health insurance
Dental insurance
401(k)
Tuition reimbursement
Paid time off
Vision insurance
401(k) matching
Loan assistance
Flexible schedule
Life insurance

Qualifications

Master's degree
Requirements analysis
Packaging design
3D modeling
Electrical Engineering
Research & development
Technical Proficiency

Full Job Description

About Us

Metamagnetics (Metamag) is a fast-growth defense tech company focused on enabling electromagnetic spectrum dominance for the evolving battlespace. We engineer disruptive technologies that redefine the capabilities of the RF front-end to solve the persistent challenges of electronic warfare. Our customers include the Department of Defense, major defense prime contractors and leading technology companies.

Metamag is a mission-oriented company with a collaborative culture that fosters growth and success for our employees. Our team has deep expertise in materials science, high-frequency engineering and product development. We combine a dynamic startup vibe with the stability of an established company that has been a trusted partner to our customers for nearly two decades. Metamag is located in the Boston metropolitan area.

Position

A Senior Packaging Engineer will lead the Product package development supporting NPI from concept through production release. This individual will work with and provide direction to engineering team for optimum, cost-effective solutions as well as providing thermal design and analysis for package and system-level physical designs. Package types may include plastic molded lead frame packages, ceramic packages, and metal enclosures for RF and integrated microwave assemblies. Responsibility also includes validating package compliance with MIL-SPEC standards. Proven record of managing multiple product development programs in parallel and deliver on schedule in a high-volume manufacturing process is highly desirable. Additional responsibilities include leading technical ideation and technical approaches for bid and proposal, whitepaper, and non-recurring engineering activities. Successful candidates will have a firm grasp of both the technical and market landscapes for METMAG’s products and technology. This is a unique opportunity to join a rapidly growing defense tech startup that is making a real impact on the industry, as well as to work with an exceptional team of RF, electrical, mechanical and materials engineers.

Responsibilities

Technical lead for RF/microwave plastic, ceramic and metal packages
Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
Work with vendors and internal engineering resources to establish and update design rules for packaging
Establish and implement robust assembly processes internally and CM partners
Troubleshoot packaging defects, then define and implement solutions
Working with Quality organization, characterize failure modes, and analyze as a function of packaging materials and processes
Provide thermal modeling and application notes for new packages

Qualifications

7+ years of professional experience in RF/Microwave hardware development. Background in the Aerospace/Defense industry is preferred. Proficiency in the following areas: RF circuit/component design, systems engineering, prototyping and assembly of hardware, linear and non-linear RF/microwave modeling and testing, and researching ferromagnetic phenomena in materials.
Bachelor’s degree in Mechanical Engineering, Materials Engineering or related with a focus on Surface Mount Packaging development. Master’s degree and/or PhD is an advantage.
Proactive, problem-solver and ability to excel individually and as part of a team
Technical Mastery: Expertise in advanced IC package process development, design and thermal analysis with emphasis on RF and Microwave ICs. Deep Knowledge of product characterization and reliability testing standards [JEDEC, IPC, EIA, RoHS, WEEE] Experience in failure analysis methodology. Experience in solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software is a plus. Deep knowledge of diverse materials utilized for RF components and module packaging and assembly
US Citizenship or Permanent Residency required
Possess or have ability to hold a Security Clearance (Secret)

Benefits

Competitive Paid Time Off program
Company-paid medical, dental, and vision insurance for employees and their families
Company-paid life insurance, short-term disability, long-term disability, and accidental death & dismemberment coverage
401(k) plan with company match
Tuition reimbursement and student loan assistance

Pay: $140,000.00 - $170,000.00 per year

Benefits:

401(k)
Flexible schedule
Health insurance
Paid time off
Relocation assistance
Tuition reimbursement

Application Question(s):

Do you hold a US Citizenship or Permanent Residency?

Work Location: In person

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