Top 12 Tct Properties Jobs

Dielectric and Polymer Materials Engineer
Absolics Inc —Covington, GA
- $100,000 - $150,000 a year
- Full-time
- 3 years
- Analysis skills
- Doctor of Philosophy
- Disability insurance
- Dental insurance
13d
Senior Product Specialist, Thermal Interface Materials (TIMs)
Boston Materials —Billerica, MA
- $120,000 - $180,000 a year
- Full-time
- 3 years
- Master's degree
- Continuous improvement
- Paid parental leave
- Paid holidays
Quick Apply
Senior Materials Engineer, Thermal Interface Material Integration
Boston Materials —Billerica, MA
- $120,000 - $180,000 a year
- Full-time
- 3 years
- Master's degree
- Assembly
- Paid parental leave
- Paid holidays
Quick Apply
EHS Associate
TRP Infrastructures Services —Atlanta, GA
- $55,000 - $60,000 a year
- Weekends as needed
- CPR Certification
- Clean driving record
- Microsoft Excel
- Disability insurance
- Health insurance
Quick Apply
Senior Applications Engineer, Thermal Interface Material Integration
Boston Materials —Billerica, MA
- $120,000 - $180,000 a year
- Full-time
- 3 years
- Master's degree
- Assembly
- Paid parental leave
- Paid holidays
Quick Apply
Senior Mechanical Engineer, Thermal Interface Material Integration
Boston Materials —Billerica, MA
- $120,000 - $180,000 a year
- Full-time
- 3 years
- Master's degree
- Assembly
- Paid parental leave
- Paid holidays
Quick Apply
Maintenance Technician II - Streets
City of Tolleson —Tolleson, AZ
- $24.86 - $34.80 an hour
- Email
- CDL B
- Heavy equipment operation
- CDL A

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Dielectric and Polymer Materials Engineer

Absolics Inc
Covington, GA

Apply Now

Job Details

Full-time
$100,000 - $150,000 a year
13 days ago

Benefits

Disability insurance
Dental insurance
Paid time off
Cell phone reimbursement
401(k) 6% Match
Vision insurance
401(k) matching

Qualifications

Failure mode analysis in electrical engineering
Defect analysis
Differential scanning calorimetry (DSC)
Reliability analysis
Material selection and characterization
Materials analysis (analytical chemistry specialty)
Physical analysis
Fourier-transform infrared (FTIR) spectroscopy
Electrical reliability testing
Thermogravimetric analysis (TGA)
Failure analysis

Full Job Description

Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications

Location: Covington, GA

Job Type: Full-Time

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

Key Responsibilities:

Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms

Required Skills:

Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
Fluent in English; proficiency in Korean is a plus.

Preferred Skills

Direct experience with glass core or glass interposer dielectric process integration
Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
Experience with CMP of dielectric films in damascene or hybrid bonding contexts
Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
Track record of material supplier engagement and collaborative efforts for material testing and qualification
Publication record or patent activity in dielectric materials for packaging is a plus

Education

Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
M.S. with 3+ years of relevant industry or research experience considered

Benefits:

401K 6% matching (NO vesting period)
Healthcare 100% support (Health, Dental, Vision)
Life, STD, LTD 100 % support
Cell phone allowance
PTO and self-development

SALARY:

$100,000 – $150,000

Apply Now

Refine Your Search

Tct Properties jobs

Dielectric and Polymer Materials Engineer

Senior Product Specialist, Thermal Interface Materials (TIMs)

Senior Materials Engineer, Thermal Interface Material Integration

EHS Associate

Senior Applications Engineer, Thermal Interface Material Integration

Senior Mechanical Engineer, Thermal Interface Material Integration

Maintenance Technician II - Streets

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