Process Integration and Yield Technician
Intel —Phoenix, AZ
- $60,450 - $85,340 a year
- Full-time
- Engineering
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- 1 year
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7d
Process Integration Development Engineer
Intel —Hillsboro, OR
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- Master's degree
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Process Integration Development Engineer
Intel —Hillsboro, OR
- $155,520 - $219,550 a year
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- Hybrid work
- Mid-level
- Doctor of Philosophy
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- Disability insurance
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Advanced Wafer/Package Assembly Development Integrator
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- 3 years
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4d
Module Development Engineer
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Intel Foundry Yield Development Engineer
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Mask Operations Module Engineer
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Mask Operations Module Engineer
Intel —Hillsboro, OR
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Module Development Engineer
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- System design
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WATD Module Development Engineer
Intel —Hillsboro, OR
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5d
Advanced Packaging Dry Etch Module Development Engineer
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7d
Intel Foundry Module Development Engineer
Intel —Hillsboro, OR
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- Master's degree
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HBI Module Development Engineer
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20h
Research Technician
Intel —Hillsboro, OR
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13d
OTF Failure Analysis Technician - Night Shift
Intel —Phoenix, AZ
- $60,450 - $99,770 a year
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Device Engineer
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Director, SoC Design Engineering
Intel —Santa Clara, CA
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- 6 years
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Operations Research Engineer
Intel —Phoenix, AZ
- $149,600 - $211,200 a year
- Full-time
- Mid-level
- Master's degree
- SQL
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Facilities Water/Waste Treatment Technician
Intel —Albuquerque, NM
- $85,080 - $120,110 a year
- Full-time
- Mid-level
- 2 years
- Health insurance

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Process Integration and Yield Technician

Intel -
Phoenix, AZ

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Job Details

Full-time
$60,450 - $85,340 a year
7 days ago

Benefits

Health insurance

Qualifications

Experience in a research and development laboratory environment

Full Job Description

Job Details:

Job Description:

We are part of the assembly and test technology development team based in Chandler, supporting advanced electronic packaging technology development. Our team directly supports quality and reliability failure analysis and also supports package material and assembly process development. The candidate will be responsible for conducting failure analysis to identify electrical failures, as well as physical failure analysis to support root cause understanding of new package technologies. Require setting up, operating and maintaining laboratory instruments, conducting experiments, making observations and documenting results, and often developing conclusions. Candidate should exhibit the following behavioral traits: • Verbal and technical writing skills. • Work well with a team, deliver under pressure, and well organized.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:

Candidate must possess an Associate degree or Bachelor's degree in Material Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering or related fields of study.
1+ years of hands-on project experience on a scientific topic, familiar with basic scientific principles and has some laboratory experience.

Preferred Qualifications:

Prior experience with electrical failure analysis, mechanical polisher, optical microscope, electron microscopy.
Some understanding of packaging material property and behavior

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $60,450.00-85,340.00 USD (Hourly Role)

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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