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Advanced Packaging Dry Etch Module Development Engineer

Intel -
Hillsboro, OR

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Job Details

Full-time
$133,800 - $255,200 a year
12 days ago

Benefits

Health insurance

Qualifications

Industrial equipment

Full Job Description

Job Details:

Job Description:

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.

Key Responsibilities

Develop and optimize plasma etch processes for advanced packaging applications
Design experiments (DOE) to characterize process windows and optimize etch performance
Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
Partner with equipment suppliers to design, test, and implement innovative process solutions.
Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates

Minimum Qualifications

Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.

Experience listed above should be a combination of the following:

Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.

Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
Experience with plasma etch equipment platforms

Preferred Qualifications

Experience in wafer-level assembly, advanced packaging, or related technologies.
Demonstrated success in leading programs from initial strategy development through high-volume production.
Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.

Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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