Top 6379 Engineering Architect Jobs

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The Hiring Method, LLC —Fremont, CA
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- Master's degree
- Analysis skills
- Continuous improvement
- Health insurance
- Dental insurance
Quick Apply
2d
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AI Engineering Architect – Agentic AI & Digital Engineering
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- $118,800 - $178,200 a year
- Full-time
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- 8 years
- Senior level
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Intone Networks —Remote
- Contract
- Analysis skills
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10d

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Sr. Principal Hardware Architect

The Hiring Method, LLC -
Fremont, CA

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Job Details

$150,000 - $190,000 a year
2 days ago

Benefits

Health insurance
Dental insurance
401(k)
RSU
Vision insurance

Qualifications

Customer communication
New product introduction engineering projects
Engineering development testing
Communications systems expertise (engineering specialty)
Electrical system design
Optics
System design for system development
Production validation processes
Electrical engineering training
Telecommunications RF engineering
Design engineering
Printed circuit board (PCB) layout
Electrical troubleshooting
Product design
Technical troubleshooting support
Developing electronic products
Cross-functional communication

Full Job Description

Work Setting: Hybrid – Fremont, CA (onsite preferred with flexibility to work remotely up to two days per week)

Travel: Approximately 10–20%, primarily for customer meetings, technical collaboration, and project support

Compensation: Approximately $150,000 to $190,000 base salary, depending on experience and level

Bonus: Target annual bonus of approximately 12–15%, based on level

Benefits: Comprehensive medical, dental, vision, 401(k), annual bonus, equity/RSU eligibility, and comprehensive employee benefits package

Work Authorization: Sponsorship support is available for qualified TN-1 candidates and H-1B transfers.

Position Summary

A global leader in optical communications technology is seeking a Senior Principal Hardware Architect to help design the next generation of high-speed optical transceivers powering AI infrastructure, hyperscale data centers, and high-performance computing.

This is a highly technical individual contributor role for an experienced hardware architect with expertise in high-speed electrical design, signal integrity, power integrity, and optical transceiver development. The successful candidate will play a key role in developing next-generation PAM4 optical modules supporting speeds of 1.6T, 2.4T, and beyond.

The ideal candidate is passionate about solving complex hardware challenges, enjoys working cross-functionally with multidisciplinary engineering teams, and wants to help shape products used by many of the world's largest cloud and AI infrastructure providers.

Key Responsibilities

Lead the architecture and design of high-speed optical transceivers from concept through production
Design high-speed hardware with an emphasis on signal integrity (SI), power integrity (PI), PCB/PCBA design, and RF performance
Define electrical architecture for next-generation optical modules supporting AI, machine learning, and hyperscale datacenter applications
Collaborate with firmware, software, optics, process engineering, product management, quality, and manufacturing teams throughout product development
Support system integration, design validation, EVT/DVT activities, NPI, and production readiness
Perform design reviews, troubleshooting, RF simulations, lab validation, and performance optimization
Drive continuous improvements in manufacturability, reliability, and overall product performance

Required Qualifications

Bachelor's degree in Electrical Engineering or a related discipline (Master's or Ph.D. preferred)
Experience designing hardware for optical transceivers, optical modules, or other high-speed communication systems
Strong background in signal integrity (SI/PI), PCB/PCBA design, and high-speed RF design
Experience with PAM4 signaling and high-speed serial interfaces
Hands-on experience bringing products from concept through validation and production
Strong analytical, troubleshooting, and cross-functional communication skills
Ability to thrive as a technical expert and individual contributor within a collaborative engineering organization

Preferred Qualifications

Experience with DSPs, Silicon Photonics, EMLs, drivers, TIAs, and optical packaging technologies
High-density multilayer PCB design experience
RF simulation using CST, HFSS, or similar modeling tools
Optical and electrical laboratory characterization experience
Script-based test automation
Experience supporting AI infrastructure, hyperscale datacenters, networking, or high-performance computing applications

Why This Opportunity

Opportunity to develop next-generation optical transceivers enabling AI and hyperscale networking
Highly technical role with significant influence over product architecture and design
Work alongside world-class experts in photonics, optics, and high-speed hardware engineering
Exposure to cutting-edge technologies including PAM4, Silicon Photonics, and next-generation optical interconnects
Collaborative engineering culture with strong cross-functional engagement
Competitive compensation, annual bonus, equity opportunity, and excellent long-term career growth
Opportunity to work on products deployed by many of the world's leading cloud and AI infrastructure companies

Quick Apply

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