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Equipment Engineer Module jobs near Portland, OR

WATD Module Development Engineer

Intel -
Hillsboro, OR

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Job Details

Full-time
$155,520 - $219,550 a year
21 hours ago

Benefits

Health insurance

Qualifications

AI models
Roadmap creation (System development task)
Bachelor's degree in mechanical engineering
Statistics
Master's degree in physics
Master's degree in chemistry
Chemical Engineering
Soldering
Bachelor's degree in electrical engineering
Bachelor's degree in Physics
Product roadmapping
Supplier management experience
Quality control statistical data analysis
Design of manufacturing processes
Materials engineering experience within manufacturing
Statistical Process Control
Mechanical Engineering
System design
Engineering process optimization
Project management experience in manufacturing
Master's degree
System design for system development
Assembly
Machine intelligence
Technology management experience
Doctor of Philosophy
Master's degree in mechanical engineering
Design engineering
Physics
Bachelor's degree in chemical engineering

Full Job Description

Job Details:

Job Description:

Join the Wafer Assembly Technology Development Group (WATD)

As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor packaging technology development. Your efforts will contribute to the design, optimization, and enablement of cutting-edge manufacturing processes, ensuring the successful integration of advanced technologies. By collaborating with cross-functional teams and external partners, you will help shape the technological roadmap, enabling next-generation device architectures and reinforcing Intel's leadership in semiconductor innovation. Your work will directly impact Intel's ability to meet product performance, yield, and reliability standards while advancing the boundaries of high-volume manufacturing capabilities.

Key Responsibilities

Drive technology development and enablement for both high-volume manufacturing and future technologies.
Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
Collaborate with equipment and material suppliers to design and implement enabling process technologies.
Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
Optimize production efficiency, manufacturing techniques, and output for existing and new products.
Partner with cross-functional teams to ensure process integration and alignment with project deliverables.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
OR Master's degree in the same fields with 4+ years of experience.
OR PhD in the same fields with 2+ years of experience.

Experience listed above should be a combination of the following:

Development methodologies, statistical process control, and/or data analytics.
Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.

This position is not eligible for Intel Immigration Sponsorship

Preferred Qualifications

Experience in wafer-level assembly, epoxy, mold materials, or related fields in advanced packaging.
Demonstrated expertise in leading programs from early strategy formation through high-volume production.
Recognized technical leadership with a proven track record of solving complex engineering challenges.
Experience with advanced packaging technologies such as hybrid bonded interconnects, RDL-based packaging, or ultra-fine pitch solder connections.
Strong collaboration skills with internal and external teams, including yield, operations, and supplier management.

Join Intel's mission to advance the future of semiconductor technology and make a lasting impact on a global scale. Apply now to bring your expertise and passion to our team.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Apply Now

Refine Your Search

Equipment Engineer Module jobs in Portland, OR

WATD Module Development Engineer

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Module Development Engineer

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Senior Equipment Engineer

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Principal Engineer, Hybrid Bonding Module

Process Engineer 3

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