HBI Module Development Engineer
Intel —Hillsboro, OR
- $155,520 - $298,440 a year
- Full-time
- Hybrid work
- 5 years
- Master's degree
- Analysis skills
- Health insurance
7d
Senior Integration Engineer
Jireh Semiconductor —Hillsboro, OR
- $95,000 - $140,000 a year
- Full-time
- Engineering
- 3 years
- Doctor of Philosophy
Quick Apply
8d
Module Development Defect Inspection Engineer
Intel —Hillsboro, OR
- $99,030 - $188,890 a year
- Full-time
- System design
- No experience needed
- Master's degree
- Health insurance
4d
Dry Etch module development engineer
Intel —Hillsboro, OR
- $133,800 - $255,200 a year
- Full-time
- Hybrid work
- Master's degree
- Doctor of Philosophy
- Mentoring
- Health insurance
15h
WATD Module Development Engineer
Intel —Hillsboro, OR
- $155,520 - $219,550 a year
- Full-time
- System design
- Master's degree
- Assembly
- Health insurance
12d
Advanced Packaging Dry Etch Module Development Engineer
Intel —Hillsboro, OR
- $133,800 - $255,200 a year
- Full-time
- Master's degree
- Assembly
- Doctor of Philosophy
- Health insurance
14d
Module Development Engineer
Intel —Hillsboro, OR
- $211,400 - $298,440 a year
- Full-time
- Doctor of Philosophy
- Mentoring
- Senior level
- Health insurance
Equipment Engineer - Photo
TSMC —Camas, WA
- $87,000 - $115,580 a year
- Overtime
- Background check
- Bachelor of Science
- Physical & Rehabilitation Medicine
- Profit sharing
- AD&D insurance
Senior Member of Technical Staff, Thin Films Engineer
Intel —Hillsboro, OR
- $155,520 - $298,440 a year
- Full-time
- Hybrid work
- 5 years
- Master's degree
- Analysis skills
- Health insurance
Principal Engineer, Hybrid Bonding Module
Intel —Hillsboro, OR
- $211,400 - $298,440 a year
- Full-time
- Master's degree
- 8 years
- Doctor of Philosophy
- Health insurance
Intel Foundry Module Development Engineer
Intel —Hillsboro, OR
- $155,520 - $219,550 a year
- Full-time
- Hybrid work
- 7 years
- Mid-level
- Doctor of Philosophy
- Health insurance
Senior Technologist, Hybrid Bonding Module
Intel —Hillsboro, OR
- $180,770 - $255,200 a year
- Full-time
- Master's degree
- Analysis skills
- Doctor of Philosophy
- Health insurance
System Engineer
KLA —Hillsboro, OR
- $115,900 - $197,000 a year
- Full-time
- 5 years
- Bachelor of Science
- English
- Employee stock purchase plan
- Paid holidays
Module Process Engineer IV - (E4) - Dielectric Deposition (CVD / ALD)
Applied Materials —Hillsboro, OR
- $116,000 - $159,500 a year
- Full-time
- Military
- Bachelor of Science
- Engineering
Senior Thin Films Engineer
Intel —Hillsboro, OR
- $133,800 - $255,200 a year
- Full-time
- Hybrid work
- Doctoral degree
- 5 years
- Analysis skills
- Health insurance
Staff Process Engineer, Dry Etch
Intel —Hillsboro, OR
- $133,800 - $255,200 a year
- Full-time
- Hybrid work
- Analysis skills
- Doctor of Philosophy
- Mentoring
- Health insurance
Senior Staff Process Engineer – Dry Etch
Intel —Hillsboro, OR
- $155,520 - $298,440 a year
- Full-time
- Hybrid work
- 6 years
- Analysis skills
- Doctor of Philosophy
- Health insurance
Staff Chemical Mechanical Planarization (CMP) Engineer
Intel —Hillsboro, OR
- $133,800 - $255,200 a year
- Full-time
- Hybrid work
- Doctoral degree
- 3 years
- Master's degree
- Health insurance
Director, Process Engineer – Dry Etch
Intel —Hillsboro, OR
- $211,400 - $298,440 a year
- Full-time
- Hybrid work
- Doctoral degree
- Master's degree
- In-person
- Disability insurance
- Health insurance
14d
Process Integration Development Engineer
Intel —Hillsboro, OR
- $120,860 - $231,670 a year
- Full-time
- Hybrid work
- Master's degree
- SQL
- Analysis skills
- Health insurance
6d

I want to receive the latest job alert for Equipment Engineer Module in Portland, OR

By signing in to your account, you agree to SimplyHired's Terms of Service and consent to our Cookie and Privacy Policy.

Explore jobs in more locations

Equipment Engineer Module jobs near Portland, OR

HBI Module Development Engineer

Intel -
Hillsboro, OR

Apply Now

Job Details

Full-time
$155,520 - $298,440 a year
7 days ago

Benefits

Health insurance

Qualifications

Research design
Communication with suppliers
Defect detection (quality control)
Master's degree in physics
Performance improvement leadership
Defect resolution root cause analysis
Chemical Engineering
Bachelor's degree in electrical engineering
Bachelor's degree in Physics
Team leadership
5 years
Defect rate reduction
Design of manufacturing processes
Design of experiments
Contamination control
Statistical analysis for research
Engineering process optimization
Master's degree
Team development
Analysis skills
Doctor of Philosophy
Technology transfer (scale-up process)
Engineering research
Mentoring
Design engineering
Doctoral degree in physics
Physics
Quality inspection
Bachelor's degree in chemical engineering
Master's degree in electrical engineering

Full Job Description

Job Details:

Job Description:

The Role and Impact

As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.

Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.

Key Responsibilities

Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.
Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.

Behavioral Skills

Demonstrated ability to solve complex technical problems using structured engineering methodologies.
Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
Proven ability to mentor and develop engineers and technical team members.
Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of industry experience; OR
Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of industry experience; OR
PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 5+ years of industry experience.

Industry experience must include the following:

5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging,

Preferred Qualifications

Experience leading first-of-a-kind (FOK) process or equipment development programs.
Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
Experience supporting technology transfer from development to manufacturing.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Business group:

Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Apply Now

Refine Your Search

Equipment Engineer Module jobs in Portland, OR

HBI Module Development Engineer

Senior Integration Engineer

Module Development Defect Inspection Engineer

Dry Etch module development engineer

WATD Module Development Engineer

Advanced Packaging Dry Etch Module Development Engineer

Module Development Engineer

Equipment Engineer - Photo

Senior Member of Technical Staff, Thin Films Engineer

Principal Engineer, Hybrid Bonding Module

Intel Foundry Module Development Engineer

Senior Technologist, Hybrid Bonding Module

System Engineer

Module Process Engineer IV - (E4) - Dielectric Deposition (CVD / ALD)

Senior Thin Films Engineer

Staff Process Engineer, Dry Etch

Senior Staff Process Engineer – Dry Etch

Staff Chemical Mechanical Planarization (CMP) Engineer

Director, Process Engineer – Dry Etch

Process Integration Development Engineer

I want to receive the latest job alert for Equipment Engineer Module in Portland, OR

Related Searches

Explore jobs in more locations

Job Details:

Job Description:

Qualifications:

Job Type:

Shift:

Primary Location:

Additional Locations:

Business group:

Posting Statement:

Position of Trust

Benefits

Job Seeker Tools

Employer Tools

Browse

Stay Connected