Top 37 Hardware Engineer Hp Jobs

Writing Systems Engineer 3D Printing
HP —Corvallis, OR
- $93,400 - $125,000 a year
- Full-time
- Mid-level
- Paid parental leave
- Paid holidays
Senior Hardware Engineer
HP Tuners LLC —Buffalo Grove, IL
- $110,000 - $140,000 a year
- Full-time
- Software troubleshooting
- Office
- Mentoring
- Disability insurance
- Relocation assistance
Quick Apply
Circularity Innovation Engineer
HP —Vancouver, WA
- $116,150 - $182,400 a year
- Full-time
- Engineering
- 8 years
- Manufacturing
- Paid parental leave
- Paid holidays
9d
Staff Hardware Engineer
HP Tuners LLC —Buffalo Grove, IL
- $140,000 - $170,000 a year
- Full-time
- Software troubleshooting
- Office
- 3 years
- Disability insurance
- Relocation assistance
Quick Apply
Lead Hardware Design Engineer, Devices
HP IQ —San Francisco, CA
- $170,000 - $245,000 a year
- Full-time
- Computer Science
- System design
- Mentoring
- Paid parental leave
- Paid holidays
Principal Reliability Engineer
HP —Spring, TX
- $130,700 - $205,200 a year
- Full-time
- Writing skills
- Master's degree
- Analysis skills
- Paid parental leave
- Paid holidays
MTS Principal Engineer
HP —Corvallis, OR
- $147,050 - $230,850 a year
- Full-time
- Computer science
- Computer Science
- Mentoring
- Paid parental leave
- Paid holidays
R&D Engineering Manager for Design, IDS, Reliability, and Materials
HP —Corvallis, OR
- $130,700 - $175,000 a year
- Full-time
- 5 years
- Engineering
- Mentoring
- Paid parental leave
- Paid holidays
Display Solutions Hardware Platform Enablement Architect
HP —Spring, TX
- $147,050 - $230,850 a year
- Full-time
- Computer science
- Computer Science
- Writing skills
- Paid parental leave
- Paid holidays
Process and Tooling Engineer
HP —Corvallis, OR
- $73,800 - $113,650 a year
- Full-time
- Mid-level
- Communication skills
- Mechanical knowledge
- Paid parental leave
- Paid holidays
PageWide Web Press CA&G Mechanical Engineer
HP —Corvallis, OR
- $93,400 - $143,800 a year
- Full-time
- Up to 50% travel
- Customer service
- Writing skills
- Paid parental leave
- Paid holidays
Senior Product Design Engineer
HP IQ —San Francisco, CA
- $132,000 - $230,000 a year
- Full-time
- 5 years
- Bachelor of Science
- Travel
- Paid parental leave
- Paid holidays
Tech Marketing & Performance Engineer
HP —Fort Collins, CO
- $65,600 - $101,000 a year
- Full-time
- Computer science
- Computer Science
- Data analysis skills
- Paid parental leave
- Paid holidays
AI Engineer, PC Automation
HP —Austin, TX
- $147,050 - $230,850 a year
- Full-time
- 7 years
- Computer Science
- Engineering
- Paid parental leave
- Paid holidays
Factory Services Engineering Program Manager
HP —Spring, TX
- $93,400 - $143,800 a year
- Full-time
- 5 years
- Bachelor of Science
- Writing skills
- Paid parental leave
- Paid holidays
PageWide Industrial Manufacturing and Factory Quality Engineer
HP —Corvallis, OR
- $116,150 - $171,350 a year
- Full-time
- Customer service
- Writing skills
- English
- Paid parental leave
- Paid holidays
FAB Manufacturing Process Engineer
HP —Corvallis, OR
- $83,000 - $127,800 a year
- Full-time
- Computer science
- Mid-level
- C++
- Paid parental leave
- Paid holidays
Electrical Engineer
HP —Austin, TX
- $116,150 - $182,400 a year
- Full-time
- Management
- Computer Science
- Data analysis skills
- Paid parental leave
- Paid holidays
Embedded Systems Software Engineer
HP —Corvallis, OR
- $105,050 - $150,000 a year
- Full-time
- Computer science
- Computer Science
- System design
- Paid parental leave
- Paid holidays
Power Engineer
HP —Fort Collins, CO
- $93,400 - $135,400 a year
- Full-time
- 5 years
- English
- Master's degree
- Paid parental leave
- Paid holidays
12d

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Writing Systems Engineer 3D Printing

HP -
Corvallis, OR

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Job Details

Full-time
$93,400 - $125,000 a year

Benefits

Paid parental leave
Paid holidays
Disability insurance
Health insurance
Dental insurance
Flexible spending account
Parental leave
Employee assistance program
Vision insurance
Life insurance

Qualifications

Research design
Laboratory experiment design
Design of experiments
Engineering process optimization
Data analytics
Data-driven problem-solving
Cross-functional collaboration
Cross-functional communication

Full Job Description

Writing Systems Engineer 3D Printing

Description -

We are seeking a hands-on Writing Systems Engineer to lead development of print processes for HP’s Multi Jet Fusion (MJF) 3D printing technology. This role is focused on print mode development, process optimization, and part quality, working at the intersection of materials, printheads, and printer systems.

This is a lab-based, experimental role requiring strong ownership of print performance from concept through prototype validation.

Key Responsibilities

Print Process Development

Design and execute print experiments to evaluate new agents, materials, and print modes
Develop and modify print modes to optimize part quality, throughput, and reliability
Analyze print outputs (mechanical properties, dimensional accuracy, defects) and drive improvements
Establish and standardize test methods and print templates for R&D programs
Own the relationship between print process conditions and final part performance

System Integration

Work across disciplines (chemistry, printhead, hardware, and test engineering) to develop new 3D printing capabilities
Identify and resolve issues across the print system (printheads, fluids, thermal behavior, and machine operation)
Enable rapid prototyping by integrating new materials and process concepts into working print solutions

Lab Execution & Troubleshooting

Operate and maintain R&D printing systems for experimental work
Troubleshoot print defects, variability, and process instability
Ensure equipment readiness and repeatability for test execution

Data & Tools

Utilize data systems to analyze print telemetry and metrology results
Support development of tools that improve experimentation efficiency and data traceability

Qualifications

Required

Degree in Mechanical Engineering, Chemical Engineering, Materials Science, or related field
Experience with 3D printing, additive manufacturing, or inkjet/printing systems
Strong background in experimental design, data analysis, and physical system optimization
Experience working with complex hardware systems and cross-functional teams

Preferred

Experience with HP MJF or similar powder-based additive manufacturing processes
Familiarity with print mode development, printer firmware, or process control
Understanding of materials-process interactions in thermal or fluid systems

Additional Skills

Project management, data informatics, and analytical problem-solving.
Excellent communication, teamwork, and leadership abilities.
Ability to work independently and deliver results in a dynamic environment.

Disclaimer
This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

The pay range for this role is $93,400 to $125,000 USD annually with additional
opportunities for pay in the form of bonus and/or equity (applies to United
States of America candidates only). Pay varies by work location, job-related
knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including;
4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave (US benefits overview

[https://hpbenefits.ce.alight.com/])

The compensation and benefits information is accurate as of the date of this
posting. The Company reserves the right to modify this information at any time,
with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Not Specified

Relocation -

Not Specified

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal "

Apply Now

Refine Your Search

Hardware Engineer Hp jobs

Writing Systems Engineer 3D Printing

Senior Hardware Engineer

Circularity Innovation Engineer

Staff Hardware Engineer

Lead Hardware Design Engineer, Devices

Principal Reliability Engineer

MTS Principal Engineer

R&D Engineering Manager for Design, IDS, Reliability, and Materials

Display Solutions Hardware Platform Enablement Architect

Process and Tooling Engineer

PageWide Web Press CA&G Mechanical Engineer

Senior Product Design Engineer

Tech Marketing & Performance Engineer

AI Engineer, PC Automation

Factory Services Engineering Program Manager

PageWide Industrial Manufacturing and Factory Quality Engineer

FAB Manufacturing Process Engineer

Electrical Engineer

Embedded Systems Software Engineer

Power Engineer

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