Top 1683 Principal Design Engineer devices Jobs

Principal Engineer, Package Design
SiTime Corporation —Santa Clara, CA
- $164,800 - $226,600 a year
- Full-time
- Doctor of Philosophy
- Senior level
- Mechanical knowledge
- Health insurance
- Dental insurance
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Technical Leader - Principal Mechanical Design Engineer
Nemera —Chicago, IL
- $135,000 - $165,000 a year
- Full-time
- 7 years
- Management
- Master's degree
- Referral program
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Principal Layout Design Engineer
Ampere Computing —Santa Clara, CA
- $182,000 - $273,000 a year
- Full-time
- Hybrid work
- Schematics
- Master's degree
- 8 years
- Paid holidays
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Principal Design Engineer
Leslie Controls, Inc. —Tampa, FL
- Microsoft Excel
- Senior level
- Leadership
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Principal Engineer, Power Design
Celestica —Austin, TX
- 11+ years
- Research
- Office
Principal Engineer (Mechanical)
Fresenius Kabi —Warrendale, PA
- $100,000 - $120,000 a year
- Full-time
- Bachelor of Science
- Engineering
- Master's degree
- Wellness program
- Health insurance
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Principal Data Engineer, R&D
Edwards Lifesciences —Irvine, CA
- $121,000 - $171,000 a year
- Full-time
- 6 years
- Engineering
- AWS
11d
Principal Electrical Engineer
Berkshire Grey —Bedford, MA
- $150,000 - $190,000 a year
- Full-time
- Bachelor of Science
- 8 years
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Micro-electromechanical Systems (MEMS) Engineer
General Technical Services, LLC —Adelphi, MD
- Full-time
- Background check
- Writing skills
- Microsoft Office
- Health savings account
- Relocation assistance
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Lead Epi Engineer
The Hiring Method, LLC —Fremont, CA
- 5 years
- Travel
- Mentoring
- Employee stock purchase plan
- Health insurance
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Principal Motor Controls Engineer
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 5 years
- Laboratory experience
- Analysis skills
- Paid holidays
- Disability insurance
9d
Sr Principal ASIC FPGA Engineer (Sign-on Bonus Available)
General Dynamics Mission Systems, Inc —Scottsdale, AZ
- $182,139 - $202,060 a year
- Full-time
- Hybrid work
- Research
- Master's degree
- 8 years
- Paid parental leave
- Health insurance
Principal InfoSec Engineer Application Security
Philip Morris International U.S. —Tampa, FL
- $160,000 - $200,000 a year
- Full-time
- In-person
- Senior level
- Communication skills
- Commuter assistance
- Health insurance
11d
Senior Principal ASIC FPGA Engineer
General Dynamics Mission Systems, Inc —Boise, ID
- $191,146 - $212,053 a year
- Full-time
- Hybrid work
- Research
- Master's degree
- 8 years
Principal PCB & Substrate Layout Engineer
Belcan —Phoenix, AZ
- $98 an hour
- Contract
- Engineering
- Experience equivalent to degree accepted
- Senior level
- Paid holidays
- Health insurance
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Senior Principal Process Engineer
Coherent Corp. —Sunnyvale, CA
- $127,875 - $223,813 a year
- Full-time
- 7 years
- Microsoft Outlook
- Bachelor of Science
Principal ASIC Architect - Memory Systems & AI Interconnects
Everforth —South Boston, MA
- $200,000 - $300,000 a year
- Full-time
- Computer Science
- System design
- Doctor of Philosophy
- Relocation assistance
- Health insurance
4d
Principal Engineer-Systems Design
Microchip Technology —Mount Holly Springs, PA
- $75,000 - $232,000 a year
- Full-time
- Microsoft Excel
- Travel
- In-person
- Employee stock purchase plan
- Health insurance
Automation Technician (1st and 2nd shift)
Perdue Farms, Inc. —Milford, DE
- $55 an hour
- Full-time
- System design
- 8 years
- High school diploma or GED
- Health insurance
- Dental insurance
9d
Sr. Principal RF Design Engineer
Northrop Grumman —Rolling Meadows, IL
- $135,800 - $203,600 a year
- Overtime
- 6 years
- Research
- Bachelor's degree
- Paid holidays
- Disability insurance
11d

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Principal Engineer, Package Design

SiTime Corporation -
Santa Clara, CA

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Job Details

Full-time
$164,800 - $226,600 a year

Benefits

Health insurance
Dental insurance
Parental leave
Vision insurance

Qualifications

New product introduction engineering projects
Product development project management
CAD design (engineering design task)
Packaging design
Semiconductor experience
Mechanical product development projects

Full Job Description

About SiTime

SiTime is the Precision Timing company.

Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.

Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com.

Job Summary

The Principal Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate custom-designed MEMS and CMOS components.

Responsibilities:

Develop new packaging technology for SiTime’s MEMS-based timing solutions
Lead activities for package design, development, and release-to-production
Develop, manage, and analyze DoEs running locally and overseas
Manage development activities at OSATs
Work with OSATs to prototype and test new custom package designs
Ensure new technologies achieve required performance, reliability, and quality requirements
Lead troubleshooting activities related to package design or performance

Qualifications & Requirements:

M.S or PhD. Degree in Mechanical Engineering, Material Science, or other relevant field
10+ years’ experience in semiconductor IC packaging technology and methodology
Experience managing overseas OSATs to bring products into production
Knowledge of leadframe-based, flip-chip, and substrate-based packages
Experience with flip-chip and bumping technologies
Understanding of thermal, stress, and electrical considerations in package design
Hands-on experience with CAD software (AutoCAD preferred but not required)
The desire to work in a fast-paced, challenging, and risk-taking environment

Desired Characteristics & Attributes:

Understanding of thermal, mechanical, and electrical modeling for semiconductor packages
Understanding of material characterization techniques (DMA, TMA, TGA, etc.)

Compensation Range:

At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.

The annual base salary range for this role is $164,800 - $226,600. The final offer is determined by factors such as location, experience, education, and training.

In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals—reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.

Benefits offered: 401k plan, health and wellness that includes medical, dental, vision, life, parental leave, legal services, and time off plans.

SiTime is an Equal Opportunity Employer. We treat each person fairly and we do not tolerate discrimination or harassment against anyone on the basis of any protected characteristics, including race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, pregnancy, political affiliation, protected veteran status, protected genetic information, or marital status or other characteristics protected by law. SiTime participates in the E-Verify program.

Learn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.

Innovation on Top – Philosophies of Innovation with Rajesh Vashist
Fabrication Knowledge – An Interview with Rajesh Vashist
SiTime Corporation – YouTube

#LI-SITIME

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