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Technical Project Lead (TPL) Embedded Systems & Thermal Imaging

Seek Thermal, Inc.
Goleta, CA

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Job Details

Full-time
$140,000 - $160,000 a year
4 days ago

Benefits

Health savings account
Relocation assistance
Health insurance
Dental insurance
401(k)
Flexible spending account
Tuition reimbursement
Paid time off
Parental leave
Employee assistance program
Vision insurance
401(k) matching
Professional development assistance
Flexible schedule
Life insurance
Referral program

Qualifications

Jira
Embedded systems
Master's degree
Embedded software
Requirements analysis
Scrum
Electrical Engineering

Full Job Description

Hi, We’re Seek Thermal.

Seek is a growth tech company working to bring thermal imaging to as many people as possible. With a focus on safety critical missions and high quality products, Seek is a fun tech company working to bring advanced hardware and software to its customers. This position will be located at Seek HQ in Santa Barbara, CA.

We love where we work, and so can you.Join us to lead innovative projects that transform our organization’s technological landscape! Your expertise will be instrumental in delivering high-impact solutions that drive efficiency and growth across the enterprise.

As a Technical Project Lead (TPL) at Seek Thermal, you will own the technical critical path of one or more new-product programs—the chain of design decisions, integrations, and verifications that determines whether the product works and ships. You will be accountable for design outputs, design reviews, and technical trade-offs—working alongside program management while coordinating engineering across electrical, mechanical, software/firmware, optics, and systems to bring LWIR thermal imaging products from concept through production. The Technical Project Lead will report directly to the SVP of Engineering.

RESPONSIBILITIES:

· Own the technical critical path of new product development (NPD) programs through phase gates (concept through DV, PV, and production release)—know at all times which technical task gates the program, and keep the multidisciplinary team focused on it.

· Ensure design outputs and design-review materials are complete and defensible at every gate, and provide the technical readiness signal for gate sign-off.

· Make and document technical trade-offs (e.g., image quality, runtime, cost, architecture), with cross-functional approval for scope and design changes.

· Identify technical risks early, assess their critical-path impact, and drive mitigation of technical exposure across the program.

· Assign engineering tasks, drive technical status at program meetings in step with program management, and own design documentation and approvals per Seek’s design-control process.

· Drive root-cause and corrective action (8D) when sensor, manufacturing, or integration failures threaten a milestone

· Ensure PRD requirements are testable and verification is defined before design gates; pull hardware/software integration risks off the critical path early.

· Provide technical deliverables (SOWs, specifications) for supplier engagements and represent engineering with customers, change control boards, and leadership.

SKILLS KNOWLEDGE AND ABILITIES:

· Hands-on embedded systems depth (e.g., RTOS debugging, multicore SoC/MPSoC platforms, I2C/SPI, MIPI CSI, hardware/software co-design) with independent technical judgment.

· Experience developing products under structured quality and development processes (e.g., functional safety, ASPICE, ISO 9001, or similar) within formal design controls.

· Fluency with phase-gate development, PRD/requirements management, DV/PV verification, 8D, RASIC, and planning tools (Jira, SmartSheets).

· Proven technical coordinator of distributed cross-functional teams and a clear communicator—holds a technical position, escalates cleanly, and commits once decided.

· Preferred: thermal/IR imaging (FPA/ROIC, NUC/AGC, LWIR optics), automotive qualification, semiconductor packaging/yield analysis, Agile/Scrum leadership.

QUALIFICATIONS: (Education and experience)

· Bachelor’s or Master’s degree in Electrical Engineering, Software Engineering, Mechatronics, Physics, Optical Engineering, or related field.

· 5+ years of engineering experience, including 2+ years owning the technical critical path of embedded hardware/software programs, with at least one shipped sensing or electro-optical product taken through production.

· Must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual) as required by ITAR/EAR export control regulations.

Pay: $140,000.00 - $160,000.00 per year

Benefits:

401(k)
401(k) matching
Dental insurance
Employee assistance program
Flexible schedule
Flexible spending account
Health insurance
Health savings account
Life insurance
Paid time off
Parental leave
Professional development assistance
Referral program
Relocation assistance
Tuition reimbursement
Vision insurance

Application Question(s):

Due to export controls, we are unable to sponsor work Visas. Are you a U.S. Citizen or permanent Resident?

Work Location: In person

Quick Apply

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