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Module Development Engineer

Intel -
Hillsboro, OR

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Job Details

Full-time
$155,520 - $298,440 a year

Benefits

Health insurance

Qualifications

Defect rate reduction
Design of manufacturing processes
Engineering process optimization
Industrial equipment troubleshooting
Manufacturing facility experience
Policy & process development
Leading team collaboration initiatives
Cleanroom experience
Technical troubleshooting support
Semiconductor experience
Factory experience
Statistical analysis tools
Production troubleshooting

Full Job Description

Job Details:

Job Description:

Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience

Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience

Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience

Relevant recent experience includes, but is not limited to:
- Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment
- Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms
- Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes
- Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility
- Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions
- Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment

Preferred Qualifications:

5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes
Experience with advanced dry etch technologies such as:
- ICP / CCP plasma etch
  o High aspect ratio etch (HARC)
  o Atomic Layer Etch (ALE)
  o Radical and Vapor phase isotropic etching
  o Ash and surface treatments
  o EUV patterned layer etch integration
Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion
Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements
Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation
Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving
Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions
Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

US, Arizona, Phoenix, US, California, Santa Clara

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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