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Ball Grid Array Manufacturing EngineerU7 Equipment - State College, PABall Grid Array Manufacturing Engineer Date Posted [Oct-02-09] (ID: 94442) Support the development and implementation of process techniques in microelectronic manufacturing operation including specifying, reviewing and revising economic methods, operation sequence and tooling for the fabrication of Ball Grid Arrays (BGA?s), Surface Mount, Die Bond, Wire Bond, Flip Chip assembly, and assembly of multi-chip & monolithic packages (MCP's). Requirements *** BS Degree and 4+ years in automated electronic assembly operations. *** Track record with assembly flow and manufacturing of multi-chip modules,. *** Ability to conduct Design of Experiments (DOE), statistical process control (SPC), and apply lean methods to cell manufacturing environment. Join a growing company, working to become... See job listing >30+ days ago from AllStarJobs.com - Save - Block - Flag - More Tools...
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