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Pr Mechanical Engineer (Electronics Packaging)Rockwell Collins - Cedar Rapids, IATitle: Pr Mechanical Engineer (Electronics Packaging) Location: Iowa-Cedar Rapids, IA Seeking a high-energy person to be a Principal Mechanical Engineer for the Government Systems (GS) Mechanical Design Group. The group is responsible for the electronics packaging technology development of future miniature avionic and data link products, among other products. Will be considered a specialist in a specific hardware area of thermal and structural analysis or generalist in multiple hardware areas of thermal, shock and vibration and recognized in their field or organization. Responsibilities include packaging conceptualization, advanced packaging material selection, design analysis (Thermal, Shock & Vibe), system sizing for thermal performance consideration, trade studies, integration, test... See job listing >30+ days ago from Rockwell Collins - Save - Block - Flag - More Tools...
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Rockwell Collins
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Headquarters:
400 Collins Rd Ne
Cedar Rapids, IA 52498
Phone: 319-295-1000
http://www.rockwellcollins.com - Line of Business: Mfg Avionics & Communications Equipment & Systems
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Key Numbers:
Company Type Public (COL:NYS) Company Revenue $500M+ Company Size More than 5000 employees
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