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Package Electrical DesignIntel - Phoenix, AZJob Description: As part of Intel's Assembly and Test Technology Development (ATTD) organization, you'll accelerate the development of breakthrough packaging, motherboard, and test technologies to support Intel's most advanced microprocessor and chipset products. ATTD?s Design Engineers are responsible for working closely with our chip design teams, and helping to translate their needs into new packaging designs, concepts, and constructions, as well as, optimize both the chip and the package to drive to the best total design solution. Package design gets involved very early in the planning stages for new silicon to have the earliest influence possible and the greatest impact. This early involvement is followed by the detailed design activities for the chip and the package, working in... See job listing >30+ days ago from Intel Corporation - Save - Block - Flag - More Tools...
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Intel
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Headquarters:
2200 Mission College Blvd
Santa Clara, CA 95054
Phone: 408-765-8080
http://www.intel.com - Line of Business: Mfg Semiconductors/dvcs Prepackaged Software Svc
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Key Numbers:
Company Type Public (INTC:NMS) Company Revenue $500M+ Company Size More than 5000 employees
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