Full Job Description
Assembly Test and Technology Development Microelectronic Inspection Packaging R&D Engineers provide project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
Responsible for the thermal and/or mechanical and/or electrical design, analysis, and development of electronic packages.
Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.
Conducts tests and research on basic materials and properties.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
Provides consultation concerning packaging problems and improvements in the packaging process.
Responds to customer and/or client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.
This is an entry level position and compensation will be given accordingly.
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.
Possess a bachelor's degree (with 1+ years of relevant experience preferred) or master's degree in Mechanical Engineering or Physics or any other Engineering related field.
6+ months of experience in one or more of the following:
Understanding of fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems.
Understanding of statistical principles, process control (SPC), and Design of Experiments (DOE).
Applying fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
Fundamental understanding of semiconductor devices and packing technology.
Data science and statistics tools (Python, SQL, JMP, Minitab).
Working knowledge of dimensional management for package features and planes.
Working knowledge of imaging techniques (light sources, resolutions, algorithm applications).
Past semiconductor inspection experience (wafer, package, etc).
Machine vision experience.
Semiconductor manufacturing experience.
Understanding of optics, light and/or laser-matter interaction.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....