Process Engineer – Wafer Probe & Wafer Dicing

FlipChip International - Phoenix, AZ3.7



FlipChip International, LLC (FCI) in Phoenix, AZ, is a global leader in technology and a supplier of advanced Wafer Level Packaging and Back-End services. FCI is seeking an engineer to work as a Process Engineer who will be a hands-on member of the Process Engineering Group. The focus of the Process Engineering Group is to achieve high yield and on-time delivery for our customers.


Reports to: Engineering Manager

Peers: Process, Equipment and Product Engineering Groups

Direct Reports: None


  • Responsible for wafer probe, wafer dicing, and other related processes
  • Drive technology, capability improvements, and cost reductions in FCI’s wafer saw and other back-end related operations.
  • Work with Engineering Manager and Operations Management to define engineering priorities.
  • Work with strategic material and equipment suppliers in selecting, evaluating and deploying key materials used in back-end operations.
  • Work with Equipment Engineering to ensure that all critical tool parameters are defined and are being met by regularly scheduled maintenance.
  • Evaluation and selection of process equipment required for expansion of back-end operation.
  • Work with engineering staff to write new process specifications and keep existing specifications current.
  • Work as a team player of the Process Engineering team providing expertise and support in other areas of wafer processing.
  • Present technical results obtained by presentation and in writing to FCI personnel including senior management.
  • Capable of effectively communicating with customers and suppliers both verbally and in writing, creating and executing documented project plans with milestones, ensuring that all development and characterization work is documented.
  • Weekly reports, SPC monthly reports, and project updates must be completed on time as required.


Education: An Engineering degree in Electrical, Mechanical, Manufacturing or other Bachelors of Science Degree (or related technical discipline) with related job experience is preferred.

Job Related Experience: 1-3 years of hands-on process engineering experience in wafer probe, wafer dicing, and related back-end processing for high volume manufacturing. The candidate must demonstrate the ability to work as part of a high performance team in a semiconductor operation.

Physical Requirements: The process engineer must possess the ability to work for an extended period of time in a cleanroom setting with a desire to work in a very hands-on role.

Functional Area Skills/Knowledge:

Candidate must have demonstrable process and material evaluation experience and a clear understanding of overall process development.

Strong knowledge of process control and characterization is preferred:

  • Ensure that all processes are well characterized and controlled
  • Input and response variables are defined, spec limits exist on response variables, and operating ranges are defined for input variables.
  • Measurement Systems for input and response variables are characterized and capable.

Knowledge of Failure Mode Effects Analysis (FMEA) and Design of Experiments (DOE) methodologies is highly desirable.

Candidate will be required to gain knowledge of FCI processes, process controls, material, and equipment functionality as well as FCI Quality Policies and Specifications.

Knowledge of packaging and assembly requirements and practices is a plus, as well as industry reliability and performance requirements and standards.

The successful candidate should have strong PC skills, including all Microsoft Office applications and the ability to use JMP software.

The candidate must possess the ability to work effectively and independently and is expected to work under limited supervision.

Job Type: Full-time


  • Process Engineering: 2 years (Preferred)
  • Packaging: 2 years (Preferred)
  • Microsoft Office: 2 years (Preferred)


  • Bachelor's (Preferred)