An opportunity currently exists in the Microelectronics Engineering and Technology (MET) Department as a Senior Technical Support Engineer. The Microelectronics Engineering and Technology department designs and manufactures compound semiconductor devices, millimeter/microwave integrated circuits and modules for defense and commercial applications and is a part of Raytheon Integrated Defense Systems.
As a member of the MET Department, the individual in this role will be responsible for supporting the Raytheon semiconductor foundry in the areas of process development, metals and dielectric deposition, wet chemistry processing, and visual inspection. He or she will be responsible for monitoring deposition activities in the group, maintaining deposition tools, determining electron beam deposition recipes and sustaining appropriate calibrations. The chosen candidate will assist in setting up new electron beam deposition capabilities within the group as well as maintaining current deposition capabilities. The chosen candidate will also be expected to independently improve processes in a cleanroom environment, run and maintain process equipment, and document and communicate all measurement results. The chosen candidate is also expected to work with engineers in various areas of wafer fabrication and process development on next generation technologies. An understanding of electron beam deposition, basic semiconductor processing, and cleanroom experience is required.
Responsibilities will include some or all of the following:
Work with the equipment team and external vendors to reestablish e-beam deposition operation within the development group
Oversee the installation and operation of a new e-beam deposition system
Maintain wafer cleaning processes in the development group
Train and assist team members in electron beam deposition, atomic layer deposition, sputtering, and plasma enhanced chemical vapor deposition processes, maintaining critical calibrations, and develop new deposition processes
Work with team members and engineers in the development fab to process, inspect, and characterize wafers
Document and effectively communicate all measurements and processing steps
Support the production and development fab in various deposition and processing needs
At least 4 years of experience with electron beam tool deposition processes, tool operation, tool maintenance, and calibration requirements
Understanding of III-V compound semiconductor processing techniques and equipment, whether through coursework or hands-on lab experience.
Experience with deposition processes including atomic layer deposition, plasma assisted chemical vapor deposition, and sputtering processes
Experience with film thickness metrology tools including ellipsometry and profilometry
Comfort with general wafer handling, wet chemistry processes, wafer descums, and dry etching processes
Excellent communication, documentation, and teamwork skills
Willingness to assist team members
Knowledge of III-V semiconductors, preferably Gallium Arsenide and Gallium Nitride
Desire to work in team within a semiconductor cleanroom environment
Required Education (including Major):
Bachelor’s degree +4 years of related experience, Associates +8 years of related experience, or 12+ years of related experience without a degree.
Keywords: electron beam deposition, metals deposition, compound semiconductor, metrology, cleanroom, process engineering, wafer fabrication
This position will require the ability to obtain a security clearance. Except in rare circumstances, only US Citizens are eligible for a security clearance.
This position requires either a U.S. Person or a Non-U.S. Person who is eligible to obtain any required Export Authorization. 159995