Global electronic assembly process technology for Rockwell Automation
We are looking for a experienced engineering professional; exact level will be based on depth and quality of experience. This position will support global electronic assembly operations with significant onsite time at Mequon and New Berlin facilities, and reports to the manager of manufacturing process engineering - PCBA
This engineering role supports global electronic assembly operations across Rockwell Automation facilities and operates within a specialized team positioned at the intersection of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis.
The mission is to provide expert-level leadership in electronic assembly to enhance quality, reliability, throughput, and long-term profitability through standardization, strategic capital deployment, and technology innovation.
Technical Subject Matter Expertise
- Maintain deep expertise in at least two electronic assembly processes, including but not limited to: Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick-and-place, SMT reflow, AOI, equipment maintenance & troubleshooting
Process & Standards Leadership
Develop and deploy global electronic assembly process standards
Reduce cost, improve quality, and increase throughput
Author and maintain procedures, work instructions, and training materials
Drive compliance to best‑practice standardization across global facilities
Capital Equipment & Technology Deployment
Lead equipment selection, justification, purchase, and implementation
Manage capital projects from requirement definition through production release
Benchmark emerging electronic assembly technologies via suppliers, industry conferences, and technical forums
Assessing global electronic assembly manufacturing facilities against standardized criteria
Data-Driven Process Optimization
Use DOE, control charts, and statistical analysis
Monitor and report electronic assembly KPIs to drive continuous improvement
Apply Lean Six Sigma methodologies (DMAIC and DMADV)
Cross-Functional & Design Engagement
Partner with design teams on DFM / DFA
Integrate assembly considerations into Electronic Assembly Design Guidelines
Share knowledge through presentations, documentation, and technical reviews
Bachelor's Degree in Relevant Field
Legal authorization to work in the U.S. We will not sponsor individuals for employment visas, now or in the future, for this job opening
Typically requires 8 years of experience
BS or MS in Engineering (Mechanical, Electrical, or Industrial preferred)
7–10+ years hands‑on electronic assembly manufacturing experience
Depth in solder profiling, SMT, post‑SMT or conformal coat processes
IPC‑A‑610 familiarity
Lean Six Sigma experience (Green Belt+ preferred)
You should be proficient in:
- Bachelor's Degree
- 5 Why (Root Cause Analysis Method)
- ISO 22000
- Process Engineering
- Design for Assembly (DFA)
- Electrical / Electronic Systems
- Engineering Degree
- AS9100 Experience
