Job Overview
The Senior Packaging Engineer will lead the Product package development supporting NPI from concept through production release. This individual will work with and provide direction to the engineering team for optimum, cost-effective solutions, as well as providing thermal design and analysis for package and system-level physical designs. Package types may include plastic molded lead frame packages, ceramic packages, and metal enclosures for RF and integrated microwave assemblies. Responsibility also includes validating package compliance with MIL-SPEC standards. Proven record of managing multiple product development programs in parallel and deliver on schedule in a high-volume manufacturing process is highly desirable. Additional responsibilities include leading technical ideation and technical approaches for bid and proposal, whitepaper, and non-recurring engineering activities.
Successful candidates will have a firm grasp of both the technical and market landscapes for METMAG’s products and technology. This is a unique opportunity to join a rapidly growing defense tech startup that is making a real impact on the industry, as well as to work with an exceptional team of RF, electrical, mechanical, and materials engineers.
REPSONSIBILITIES:
- Technical lead for RF/microwave plastic, ceramic and metal packages
- Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
- Work with vendors and internal engineering resources to establish and update design rules for packaging
- Establish and implement robust assembly processes internally and CM partners
- Troubleshoot packaging defects, then define and implement solutions
- Working with Quality organization, characterize failure modes, and analyze as a function of packaging materials and processes
- Provide thermal modeling and application notes for new packages
QUALIFICATIONS AND REQUIREMENTS:
- 7+ years of professional experience in RF/Microwave hardware development. Background in the Aerospace/Defense industry is preferred. Proficiency in the following areas: RF circuit/component design, systems engineering, prototyping and assembly of hardware, linear and non-linear RF/microwave modeling and testing, and researching ferromagnetic phenomena in materials.
- Bachelor’s degree in Mechanical Engineering, Materials Engineering, or related with a focus on Surface Mount Packaging development. Master’s degree and/or PhD is an advantage.
- Proactive, problem-solver, and ability to excel individually and as part of a team
- Technical Mastery: Expertise in advanced IC package process development, design and thermal analysis with emphasis on RF and Microwave ICs.
- Knowledge of product characterization and reliability testing standards [JEDEC, IPC, EIA, RoHS, WEEE]
- Experience in failure analysis methodology
- Experience in solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software is a plus
- Deep knowledge of diverse materials utilized for RF components and module packaging and assembly
- US Citizenship or Permanent Residency required
- Possess or have ability to hold a Security Clearance (Secret)
Pay: $140,000.00 - $170,000.00 per year
Benefits:
- 401(k)
- 401(k) matching
- Dental insurance
- Paid time off
- Tuition reimbursement
Work Location: In person
