Bachelor’s degree in Electrical or Computer Engineering (or equivalent experience) with 12+ years of relevant experience, or a Master’s degree with 10+ years in failure analysis and reliability engineering; PhD preferred.
Deep expertise in digital CMOS, RF device fundamentals, and advanced circuit analysis, with a proven ability to lead complex investigations and develop innovative failure analysis methodologies.
Extensive hands-on experience with advanced FA tools, including CSAM, X-ray CT, IR/NIR microscopy, and wet and dry etching decapsulation techniques.
Strong proficiency in PCB and IC design tools, along with DC and RF parametric test equipment.
Broad technical knowledge spanning failure mechanisms, reliability physics, and materials science, complemented by solid statistical analysis and reliability modeling skills.
Excellent analytical, problem-solving, and communication abilities, with a demonstrated capacity to influence technical decisions and drive cross-functional collaboration at senior levels.
Proficiency in Microsoft Office applications, including Outlook, Word, Excel, and PowerPoint.