We are seeking an Optoelectronic Engineer to perform leading research and development in next-generation optoelectronic integration technologies enabling high-bandwidth electrical and optical interconnects, heterogeneous integration, and co-packaged optical systems. This role sits at the intersection of high-frequency electrical packaging, photonic integration, heterogeneous assembly, and advanced interconnect design. The successful candidate will define how EICs, PICs, advanced substrates, and optical interfaces are co-packaged to push the boundaries of performance and efficiency.
