Others, Washington
Job Summary
Role : IC Packaging Design Engineer
Project Duration: 1 year
Start date: Beginning of Q4’26
No of resources: 4
Location : Chandler, AZ (primary) or Hillsboro, OR (secondary)
Experience Tier: Senior-level (primary); Mid-level (secondary)
- Senior-Level: ~10+ years in IC packaging / package design
- Mid-Level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design
Education : Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience :
- Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
- Candidates should have experience in the below domains:
o Physical Design & Layout
o Substrate design and layout
o SI/PI aware design implementation
o Design for performance, manufacturability, yield, and reliability
o Design rule compliance
Key Responsibilities
1. To leverage design expertise to ensure that software and products exhibit user-friendliness, intuitiveness, and alignment with user expectations, contributing to the creation of seamless user experiences.
2. To lead a team of designers, provide guidance, and ensuring the delivery of high-quality design solutions in alignment with the overall business goals.
3. To present design concepts and play a crucial role in shaping the overall design vision and strategy.
4. To stay abreast of industry trends, emerging technologies to drive innovation and excellence in design.
Maximum Salary (US): 134000
Minimum Salary (US): 88000
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