Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
We are seeking a highly experienced PCB Engineer to drive next-generation Datacenter and High-performance computing (HPC) platforms .
This role will focus on advanced PCB technologies, manufacturability optimization, and supplier engagement , supporting both NPI and volume production while shaping Qualcomm’s future hardware roadmap.
1. PCB Design & Manufacturing Readiness
Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability
2. Supplier Engagement & Capability Validation
3. NPI & Manufacturing Support
4. Technology Roadmap Development
Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.)
5. Industry & Competitive Intelligence
Minimum Qualifications:
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications:
- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
- 15+ years of PCB / substrate engineering experience (Datacenter / server / high-speed system preferred)
Strong understanding of:
- High-speed design fundamentals (SI/PI, loss, impedance control)
- Advanced PCB fabrication processes (MLB, HDI, mSAP, build-up, lamination cycles)
- PCB materials (low-loss laminates /Core & PPG, Cu foil , Plating chemistry, SR, Surface Finish, etc.)
- Experience working directly with PCB suppliers (fab + assembly/CM)
- Proven track record in NPI builds and manufacturing issue resolution
In this role, you will directly influence:
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
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Pay range and Other Compensation & Benefits :
$201,600.00 - $302,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .
If you would like more information about this role, please contact Qualcomm Careers .