We are seeking a Director/Sr. Director of Packaging Technology to lead global teams in the development and integration of packaging solutions for high-performance semiconductor products. This role will focus on package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing analog and power products from concept through qualification and high-volume production.
-
Lead the design, development, and qualification of semiconductor packaging solutions, including:
-
Flip-chip, Chip Embedding, Wafer-level packaging (WLP/FOWLP)
-
Panel-level packaging
-
System-in-package (SiP), multi-chip modules (MCM) and power modules
-
Leaded packages for power applications
-
Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements.
-
Drive package technology selection and development for new product introductions.
-
Work closely with IC design, substrate, board, thermal, reliability, and manufacturing teams to ensure package compatibility and performance.
-
Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
-
Perform and guide simulations and analysis related to thermal, mechanical, electrical, as well as design for manufacturability (DFM).
-
Develop assembly flows and process requirements for captive plants and OSATs/manufacturing partners.
-
Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.
-
Resolve packaging-related issues during NPI prototype builds, qualification, and production ramp.
-
Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.
-
Create and maintain package specifications, design rules, process documentation, and technical reports.
-
Partner closely with corporate leadership to define multi-year capability/capacity roadmaps aligned with product and business growth, resource plans, and organizational strategy.
-
MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
-
15+ years of direct experience in semiconductor packaging or advanced electronics packaging.
-
10+ years of global team management and leadership roles.
-
Strong knowledge of packaging technologies, materials, and assembly processes.
-
Experience with package reliability testing and qualification standards.
-
Deep understanding of thermal, mechanical, and electrical interactions in package design and CPI (chip-package interaction).
-
Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.
-
Ability to troubleshoot packaging failures and drive root cause/corrective action.
-
Strong project and global team leadership and cross-functional communication skills.
Core Competencies
Required: Fluent in English (written and spoken)
Mandarin a plus, but not required
Diodes Incorporated delivers advanced analog and power semiconductor solutions to the world’s leading technology companies, driving innovation, efficiency, and performance across high‑growth markets. Our teams collaborate across engineering, manufacturing, and corporate functions in a fast‑paced, transparent culture guided by Integrity, Commitment, and Innovation.
We design reliable technology that improves the world—while prioritizing sustainability, safety, and employee well‑being.
Our Vision: Inspire future technology through leading semiconductor solutions.
Diodes Incorporated is an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
