Responsible for new product concept. Design and development semiconductor Etch equipment Source. Design parts with metals, ceramics, quartz, plastics, advanced coatings, plating, etc. Design RF Match assembly/TMP shift components on Excelan, HP and other tools. Draw RF gen packaging design parts and release. Design edge rings as needed. Confirm impacted Next-Higher Assemblies (NHAs) and products, CFD (Computational Fluid Dynamics) and FEA (Finite Element Analysis).
