Packaging Engineer Salaries in Arizona
$120,065
avg per year
The average salary for Packaging Engineer jobs near Arizona is $120,065.*
Top 10 Related Jobs and Salaries
- Package Designer
- $283,600
- increased by136.2%
- Principal Software Engineer
- $143,948
- increased by19.9%
- Engineering Project Manager
- $116,636
- decreased by2.9%
- Senior Packaging Engineer
- $113,613
- decreased by5.4%
- Engineering Occupations
- $107,120
- decreased by10.8%
- Development Director
- $104,803
- decreased by12.7%
- Design Engineer
- $104,725
- decreased by12.8%
- Reliability Engineer
- $102,893
- decreased by14.3%
- Controls Engineer
- $97,656
- decreased by18.7%
- Field Service Engineer
- $79,098
- decreased by34.1%
Top Packaging Engineer jobs near Arizona
View AllPackaging Process Engineer – Microdisplay
Snapchat
Chandler, AZ
BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field. Snap is proud to be an equal opportunity employer,…
$121,000 - $214,000 a year
Substrate Packaging Research and Development Engineer
Intel
Phoenix, AZ
The successful candidate will leverage engineering fundamentals, experimental design, statistical analysis, and problem-solving skills to develop and qualify…
$133,800 - $188,890 a year
7 days ago
Silicon Packaging Design Engineer
Intel
Phoenix, AZ
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon…
$105,650 - $200,340 a year
Advanced Packaging Reliability Lab Engineer
Intel
Phoenix, AZ
Responsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of…
$133,800 - $188,890 a year
9 days ago
Packaging Module Development Engineer
Intel
Phoenix, AZ
Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress…
$133,800 - $188,890 a year
12 days ago
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs
Annapurna Labs (U.S.) Inc.
Tempe, AZ
10+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design.
$159,200 - $247,600 a year
Similar Locations
- Phoenix, AZ23 jobs
- Tempe, AZ10 jobs
- Chandler, AZ5 jobs
- Mesa, AZ2 jobs
- Scottsdale, AZ2 jobs
- Tolleson, AZ2 jobs
* Please note that all salary figures are approximations based upon third party submissions to SimplyHired or its affiliates. These figures are given to SimplyHired users for the purpose of generalized comparison only. Minimum wage may differ by jurisdiction and you should consult the employer for actual salary figures.