Packaging Engineer Salaries in Tempe, AZ

BS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field. Experience developing and sustaining wire bonding…

$121,000 - $214,000 a year

Master's degree or equivalent in mechanical engineering, electrical engineering, material science, physics or equivalent.

$159,200 - $247,600 a year

Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress…

$133,800 - $188,890 a year

12 days ago

The successful candidate will leverage engineering fundamentals, experimental design, statistical analysis, and problem-solving skills to develop and qualify…

$133,800 - $188,890 a year

7 days ago

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon…

$105,650 - $200,340 a year

Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release…

$136,000 - $212,800 a year