Top 3 Semiconductor package design engineer Jobs in Apopka, Fl

Semiconductor Package Design Engineer
Micross —Apopka, FL
- 8 years
- Organizational skills
- Senior level
- Health savings account
- Paid holidays
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Package Design Engineer | Semiconductor
Micross —Apopka, FL
- Full-time
- 8 years
- Organizational skills
- Senior level
- Health savings account
- Paid holidays
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Sr Principal Semiconductor Equipment Engineer
Northrop Grumman —Apopka, FL
- $122,800 - $184,200 a year
- Overtime
- 6 years
- Master's degree
- Bachelor's degree
- Paid holidays
- Disability insurance

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Semiconductor Package Design Engineer
Micross —Apopka, FL
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates.
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Package Design Engineer | Semiconductor
Micross —Apopka, FL
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates.
Quick Apply

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Semiconductor Package Design Engineer

Micross -
Apopka, FL

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Job Details

Benefits

Health savings account
Paid holidays
Health insurance
Dental insurance
Flexible spending account
Tuition reimbursement
Employee assistance program
Vision insurance
401(k) matching
Life insurance
Pet insurance

Qualifications

Bachelor's degree in mechanical engineering
Capacitors
Requirements design
Bachelor's degree in electrical engineering
Electromagnetic theory
Mechanical Engineering
CAD design (engineering design task)
8 years
SoC
Bachelor's degree in engineering
Requirements analysis
Design engineering
Organizational skills
Document archiving
Engineering product development
Simulation tools
Senior level
Documentation Handling
Electrical Engineering
Cross-functional collaboration
Electrical optimization
Communication skills
Cross-functional communication

Full Job Description

Essential Duties and Responsibilities:

The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization

Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates
Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
Work with IC design team to define IC package requirements
Design package layout using standard CAD tools
Extract package parasitics and conduct PI/SI analysis
Documentation and release in appropriate archival system

Preferred Knowledge, Skills, And Abilities

Layout:

Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.

Analysis:

Celsius PowerDC (IR Drop)
Sigrity Advanced SI II: Analysis tools for Signal integrity of parallel busses ( DDRx) and serial links (PCIe Gen x), including Package and PCB effects
Sigrity Advanced PI II: Power Integrity tools ( IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects

RF / Microwave Design

AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development

Qualifications

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline.

8 to 10 years of experience in semiconductor packaging design, modeling, and simulations
Strong authority on Cadence Allegro Package Designer Plus (APD+)
Experience on interposer and substrate layouts and design in advanced package technologies
Experience with 2.5D, 3D package design
Experience with design teams on floor plan, bump and layout optimization
Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated
Record of success in cross-functional team environment
Good experience with SI/PI tools for package level extraction/simulation

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.

www.Micross.com (http://www.Micross.com)

Education

Required

Bachelors or better in Electrical Engineering or related field

Behaviors

Required

Team Player: Works well as a member of a group
Thought Provoking: Capable of making others think deeply on a subject

Preferred

Detail Oriented: Capable of carrying out a given task with all details necessary to get the task done well

Motivations

Required

Ability to Make an Impact: Inspired to perform well by the ability to contribute to the success of a project or the organization
Self-Starter: Inspired to perform without outside help

Equal Opportunity Employer
This employer is required to notify all applicants of their rights pursuant to federal employment laws. For further information, please review the Know Your Rights (https://www.eeoc.gov/poster) notice from the Department of Labor.

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semiconductor package design engineer jobs in apopka, fl

Semiconductor Package Design Engineer

Package Design Engineer | Semiconductor

Sr Principal Semiconductor Equipment Engineer

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