Top 125 Physics ai thermal mechanical reliability Jobs

Physics AI - Thermal-Mechanical Reliability
Flexcompute Inc. —Watertown, MA
- Doctor of Philosophy
- Mentoring
- Recruiting
- Health insurance
- Dental insurance
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Advanced Electrical Engineer
General Dynamics Mission Systems, Inc —Canonsburg, PA
- $112,500 - $122,500 a year
- Full-time
- 3 years
- Master's degree
- Senior level
- Paid parental leave
- Health insurance
Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal
Eliyan —San Francisco Bay Area, CA
- Full-time
- 5 years
- Master's degree
- Analysis skills
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Sr. Staff Engineer, Free-Space Optics
Ayar Labs —San Jose, CA
- $190,000 - $240,000 a year
- 6 years
- Bachelor of Science
- Analysis skills
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Critical Facilities Engineer – Direct-to-Chip Liquid Cooling
Skybox Critical Operations —Hutto, TX
- $104,000 - $114,400 a year
- Full-time
- 5 years
- Mid-level
- High school diploma or GED
- Wellness program
- 401(k) matching
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Lead Thermal Mechanical Engineer
Powerlattice Technologies Inc. —Vancouver, WA
- $175,000 - $225,000 a year
- Full-time
- Hybrid work
- Doctor of Philosophy
- Senior level
- Mechanical knowledge
- Health insurance
- Dental insurance
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5d
Principal Thermal Engineer - Space Payload Design, Analysis and Modeling
Infleqtion —Louisville, CO
- $160,000 - $200,000 a year
- Full-time
- Hybrid work
- 6 years
- Engineering
- Master's degree
- Paid parental leave
- Health savings account
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Camera Test Engineer
Anduril Industries —Lexington, MA
- $98,000 - $130,000 a year
- Email
- Mid-level
- 3 years
- Continuous improvement
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11d
Senior Technical Product Manager - Cryogenic Infrastructure & Controls
VEIR —Boston, MA
- $150,000 - $170,000 a year
- 5 years
- Product management
- Senior level
- Paid parental leave
- Health insurance
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Staff Biomedical Product Engineer (Medical Device) – Newark, DE or Tarrytown, NY
Siemens Healthineers —Newark, DE
- $131,910 - $181,379 a year
- Full-time
- 5 years
- Engineering
- Presentation skills
- Disability insurance
- Health insurance
AI Data Center Power Architect
BIZLINK TECHNOLOGY INC —Fremont, CA
- Background check
- System design
- Master's degree
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Sr. MEMS Development Engineer
SiTime Corporation —Santa Clara, CA
- $138,800 - $190,850 a year
- Full-time
- Data analysis skills
- Mid-level
- Doctor of Philosophy
- Health insurance
- Dental insurance
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Component Engineer Electro-Mechanical Devices
OmniOn Power Inc. —Plano, TX
- Full-time
- Bachelor of Science
- Mid-level
- Office
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Power Electronics Engineer
Thea Energy —Kearny, NJ
- $95,000 - $160,000 a year
- Weekends as needed
- 5 years
- Master's degree
- Assembly
- Health insurance
- Dental insurance
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2d
Simulation & Modeling Engineer
AMPERA INC —Palm Beach Gardens, FL
- Full-time
- 5 years
- Analysis skills
- Doctor of Philosophy
- AD&D insurance
- Disability insurance
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Avionics Systems Engineer – Flight Safety Systems (FTS / AFSS)
Hermeus —Los Angeles, CA
- $91,800 - $224,250 a year
- Full-time
- 5 years
- Senior level
- Electrical Engineering
- Paid parental leave
- Health insurance
Quick Apply
Motion Control Engineer
Accuray Incorporated —Madison, WI
- Full-time
- Computer Science
- Research
- Assembly
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Mechanical Engineer IV
Applied Materials —Santa Clara, CA
- $147,000 - $202,500 a year
- Full-time
- Schematics
- 5 years
- Master's degree
Senior Signal Integrity / Power Integrity (SI/PI) Engineer
Arista Networks —Santa Clara, CA
- $180,000 - $275,000 a year
- Full-time
- Bachelor of Science
- Research
- Office
- Health insurance
- Dental insurance
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10d
Senior Cryogenic Engineer
Microsoft —Redmond, WA
- $119,800 - $261,000 a year
- Full-time
- Background check
- Doctoral degree
- Up to 50% travel
4d

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Physics AI - Thermal-Mechanical Reliability

Flexcompute Inc.
Watertown, MA

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Job Details

Benefits

Health insurance
Dental insurance
401(k)
Vision insurance
Gym membership

Qualifications

AI models
Research project technical leadership
Machine intelligence
Doctor of Philosophy
Solid mechanics
AI implementation
Simulation tools
Machine learning (ML) fundamentals
Design for reliability (DFR)

Full Job Description

Flexcompute is a cutting-edge technology startup that specializes in ultra-fast simulation technology. Our products are utilized by companies in designing and optimizing technology products, with applications ranging from designing airplanes and cars to wind turbines and quantum computing chips. Our customer base includes both household names and startups in emerging industries. Our company was founded by world-renowned leaders in simulation technology from Stanford University and MIT. Backed by top VC firms, we are poised to disrupt the billion-dollar engineering simulation industry with our fast-growing trajectory

Our core technology features the world’s fastest GPU solvers, capable of delivering orders-of-magnitude speedups over traditional tools. By integrating these solvers with our Physics AI Foundation Models, we enable engineers to explore design spaces that were previously computationally inaccessible. At Flexcompute, we don’t just make simulations faster; we make the “impossible” solvable, helping our partners tackle the most critical challenges in 3D-IC design, aerospace, and beyond.

Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability. In this role, you will be the primary architect of how we apply our world’s fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry’s most critical bottleneck: the structural and thermal integrity of advanced packaging.

You will lead the strategy for solving high-stakes issues such as warpage, CTE mismatch, and thermal-induced stress in 3D-ICs and chiplet architectures. You aren’t just using tools; you are defining the future of how AI and high-performance computing (HPC) converge to make 3D chips viable at scale.

Requirements

Education: PhD in Mechanical Engineering, Materials Science, Physics, or a related field with a deep specialization in computational multi-physics.
Subject Matter Authority: Recognized expertise in 3D-IC reliability, with a profound understanding of the mechanics of warpage, interfacial delamination, and thermal-mechanical coupling in heterogeneous integration.
AI/Simulation Fluent: A strong perspective on the role of GPU acceleration and Machine Learning in scientific computing.
Industry Track Record: 10+ years of experience in the semiconductor or microelectronics industry, having led technical projects that directly impacted product reliability or time-to-market.

Responsibilities

Strategic Leadership: Own the technical roadmap for the thermal-mechanical domain. Define how our Physics AI accelerates traditional FEA/multi-physics workflows to provide real-time reliability insights.
Architectural Innovation: Design end-to-end simulation workflows that address complex 3D-IC challenges, including through-silicon via (TSV) stress, micro-bump reliability, and global package warpage.
High-Stakes Collaboration: Act as the lead technical partner for world-class semiconductor companies, demonstrating how Flexcompute’s speed transforms their iterative design cycles from days to minutes.
Product Influence: Directly influence the development of our GPU-accelerated solvers, ensuring they are optimized for the non-linear material behaviors and multi-scale meshes required for advanced packaging.
Team Building: Recruit, mentor, and lead a high-performing team of engineers specialized in computational mechanics and AI-driven physics.

Benefits

Competitive compensation with equity of a fast-growing startup.
Medical, dental, and vision health insurance.
401(k) Contribution.
Gym allowance.
Friendly, thoughtful, and intelligent coworkers.

Quick Apply

Refine Your Search

physics ai thermal mechanical reliability jobs

Physics AI - Thermal-Mechanical Reliability

Advanced Electrical Engineer

Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

Sr. Staff Engineer, Free-Space Optics

Critical Facilities Engineer – Direct-to-Chip Liquid Cooling

Lead Thermal Mechanical Engineer

Principal Thermal Engineer - Space Payload Design, Analysis and Modeling

Camera Test Engineer

Senior Technical Product Manager - Cryogenic Infrastructure & Controls

Staff Biomedical Product Engineer (Medical Device) – Newark, DE or Tarrytown, NY

AI Data Center Power Architect

Sr. MEMS Development Engineer

Component Engineer Electro-Mechanical Devices

Power Electronics Engineer

Simulation & Modeling Engineer

Avionics Systems Engineer – Flight Safety Systems (FTS / AFSS)

Motion Control Engineer

Mechanical Engineer IV

Senior Signal Integrity / Power Integrity (SI/PI) Engineer

Senior Cryogenic Engineer

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