Top 394 Rf test engineer Jobs in Arizona

Principal PCB & Substrate Layout Engineer
Belcan —Phoenix, AZ
- $98 an hour
- Contract
- Engineering
- Experience equivalent to degree accepted
- Senior level
- Paid holidays
- Health insurance
Quick Apply
Senior RF Test Engineer
Raytheon —Tucson, AZ
- $86,800 - $165,200 a year
- Full-time
- 5 years
- Laboratory experience
- Assembly
- Paid holidays
- Disability insurance
5d
Senior Systems RF Integration and Test Engineer
General Dynamics Mission Systems, Inc —Scottsdale, AZ
- $111,123 - $123,278 a year
- Full-time
- 3 years
- Master's degree
- Continuous improvement
- Paid parental leave
- Health insurance
8d
Telemetry and Flight Terminations Engineer II
Raytheon —Tucson, AZ
- $68,900 - $131,100 a year
- Full-time
- Laboratory experience
- Mid-level
- Electrical Engineering
- Paid holidays
- Disability insurance
3d
Principal RF Engineer
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- Office
- 8 years
- Travel
- Paid holidays
- Disability insurance
Principal Electrical Engineer - Test
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 5 years
- Analysis skills
- In-person
- Paid holidays
- Disability insurance
Raytheon Full Time 2026 - RF Design Engineer II
Raytheon —Tucson, AZ
- $68,900 - $131,100 a year
- Full-time
- Senior level
- Electrical Engineering
- Paid holidays
- Disability insurance
5d
Principal RF Sensor and Calibration Specialist
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 6 years
- Presentation skills
- In-person
- Paid holidays
- Disability insurance
Principal RF Sensor Design Specialist
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 5 years
- Presentation skills
- Doctor of Philosophy
- Paid holidays
- Disability insurance
Systems Engineer II - Signal Processing
Raytheon —Tucson, AZ
- $68,900 - $131,100 a year
- Full-time
- Java
- Analysis skills
- Presentation skills
- Paid holidays
- Disability insurance
Senior Systems Engineer - Telemetry (Onsite)
Raytheon —Tucson, AZ
- $86,800 - $165,200 a year
- Full-time
- 5 years
- In-person
- Senior level
- Paid holidays
- Disability insurance
Principal RF Subsystems Engineer
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 5 years
- Bachelor of Science
- Engineering
- Paid holidays
- Disability insurance
Power Electronics Engineer II
Raytheon —Tucson, AZ
- $68,900 - $131,100 a year
- Full-time
- Engineering
- Laboratory experience
- Mid-level
- Paid holidays
- Disability insurance
Principal Antenna & RF Sensor Test Range Architect & Integrator
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 8 years
- Presentation skills
- Doctor of Philosophy
- Paid holidays
- Disability insurance
5d
Principal RF Data Link Engineer
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 5 years
- Laboratory experience
- Master's degree
- Paid holidays
- Disability insurance
Engineer Electronics Level 3
Northrop Grumman —Gilbert, AZ
- $98,400 - $147,600 a year
- Overtime
- Research
- Mid-level
- Master's degree
- Paid holidays
- Disability insurance
5d
Senior Antenna & RF Sensor Test Range Architect & Integrator
Raytheon —Tucson, AZ
- $86,800 - $165,200 a year
- Full-time
- 5 years
- Presentation skills
- Doctor of Philosophy
- Paid holidays
- Disability insurance
5d
Low Observable Materials Engineer
Raytheon —Tucson, AZ
- $132,400 - $251,600 a year
- Full-time
- 7 years
- Analysis skills
- C++
- Paid holidays
- Disability insurance
Electrical Engineer II (Onsite)
Raytheon —Tucson, AZ
- $68,900 - $131,100 a year
- Full-time
- Mid-level
- Analysis skills
- Scripting
- Paid holidays
- Disability insurance
Pr. Electronic Materials Failure Analysis Engineer
Raytheon —Tucson, AZ
- $107,500 - $204,500 a year
- Full-time
- 5 years
- Analysis skills
- Experience equivalent to degree accepted
- Paid holidays
- Disability insurance

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Principal PCB & Substrate Layout Engineer

Belcan -
Phoenix, AZ

Quick Apply

Job Details

Contract
$98 an hour

Benefits

Paid holidays
Health insurance
Dental insurance
401(k)
Paid time off
Vision insurance
Life insurance

Qualifications

3D modeling software
3D modeling for product design
Printed circuit board (PCB) layout

Full Job Description

Job Title: Principal PCB & Substrate Layout Engineer
Pay Rate: $98/hr.
Location: Phoenix, AZ
Zip Code: 85034
Job Type: Contract
Job Duration: 7 Months
Schedule and Shift: 9-80 A|1st Shift|09:00 AM|N
Keyword's: #Phoenixjobs; #PrincipalPCBjobs; #SubstrateLayoutEngineerjobs; #INDSUB
Start Date: Immediate

We provide a competitive pay and benefits package. This position is offering a pay rate of $98/hr. however, Belcan considers several factors when extending an offer, including but not limited to education, experience, geographic location, and discipline. Benefits offered may include health care, dental, vision, life insurance; 401(k); education assistance; paid time off including PTO, holidays, and any other paid leave required by law.

Job Summary: Principal PCB & Substrate Layout Engineer
Our client"s Microsystems business is seeking an experienced Principal PCB & Substrate Layout Engineer to join our growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation"s defense. Client sits at the intersection of high-tech and defense - we are focused on accelerating innovations that matter to the aerospace, defense, and space sectors. We leverage our longstanding strategic partnerships to access the latest in commercial technologies to design, manufacture, test, and deliver rugged microelectronics that operate in the harshest environments, with extreme reliability and maintainability. Client partners closely with the U.S. government delivering onshore trusted microelectronics.

You are responsible for:
Providing technical leadership to the engineering team specifically focused on High-Speed Interfaces and High Density Substrates layout techniques and understanding and improving our layout development processes to ensure we produce quality products using your expertise in PCB and Substrate layout engineering.

Responsibilities:

Driving design, layout, and analysis of complicated electrical and mechanical systems and their constituent parts including: high-density interposers, substrates, and printed circuit board (PCB) layouts. This includes power, digital, analog, and RF signals across multiple die (primarily flip-chip)
Hands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.
Understand Design For Manufacturing rules of our suppliers and ensure design process matches their capabilities
Understand and provide fabrication drawings that match the intent of the design and support the fabrication suppliers to ensure the technical intent is transferred successfully
Support package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
Work with peers and the engineering team to review the artwork and drawings at different stages and at the final design review for fabrication and assembly
Provide support for multidisciplinary investigations and feasibility studies with collaboration across engineering disciplines
Provide Technical guidance for interfacing to customers, subcontractors, assemblers, fabricators, and vendors/suppliers, operations, quality, supply chain, and supporting organizations
Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors
Considers the effects of actions on the system as a whole, i.e. 'systems-thinking'
Willing to help the team in areas outside of specific technical discipline to accomplish goals

You will be a part of:
The team responsible for the rapid development of affordable, chip-scale, secure, open system architecture devices. This leading-edge capability also addresses a need by the Department of Defense (DoD) for made-in-USA microelectronics that equip our warfighters with state-of-the-art, Trusted, military-grade products that leverage the most advanced commercial technologies..

To succeed in this role, you should have the following skills and experience:

Minimum Education: Bachelor's Degree in Engineering or equivalent education and experience required
Minimum Experience: 10+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+
Experience with APD+ physical and electrical constraint editor
HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below
Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques
Experience using a Cadence schematic / netlist driven CAD layout process, e.g. Cadence APD+ (Allegro) and supporting tools
High-end FPGA package or board design experience
Ability to work with our Mechanical team to design full 3D models for fit checks and thermal
Understanding of layout techniques in Digital, Analog, and/or RF layouts
Knowledge of electronic packaging techniques
Experience using a CAM package for manufacturing data validation. Knowledge of CAM350 & Blueprint is preferred
Working knowledge of JEDEC /IPC design, fabrication, and assembly specifications
Experience creating assembly documentation and fabrication deliverables per company and industry standards
Must be a US Person
Work effectively individually and as part of a team
Embrace the company culture that includes the following values and behaviors:

o Teamwork, execution, and communication

Belcan is an equal opportunity employer. Your application and candidacy will not be considered based on race, color, sex, religion, creed, sexual orientation, gender identity, national origin, disability, genetic information, pregnancy, veteran status or any other characteristic protected by federal, state or local laws.

Quick Apply

Refine Your Search

rf test engineer jobs in arizona

Principal PCB & Substrate Layout Engineer

Senior RF Test Engineer

Senior Systems RF Integration and Test Engineer

Telemetry and Flight Terminations Engineer II

Principal RF Engineer

Principal Electrical Engineer - Test

Raytheon Full Time 2026 - RF Design Engineer II

Principal RF Sensor and Calibration Specialist

Principal RF Sensor Design Specialist

Systems Engineer II - Signal Processing

Senior Systems Engineer - Telemetry (Onsite)

Principal RF Subsystems Engineer

Power Electronics Engineer II

Principal Antenna & RF Sensor Test Range Architect & Integrator

Principal RF Data Link Engineer

Engineer Electronics Level 3

Senior Antenna & RF Sensor Test Range Architect & Integrator

Low Observable Materials Engineer

Electrical Engineer II (Onsite)

Pr. Electronic Materials Failure Analysis Engineer

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