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10d
Module Development Engineer - RF Test
Intel —Phoenix, AZ
- $115,110 - $219,550 a year
- Full-time
- Mid-level
- Master's degree
- Doctor of Philosophy
- Health insurance
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Packaging Module Development Engineer

Intel -
Phoenix, AZ

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Job Details

Full-time
$133,800 - $219,550 a year

Benefits

Health insurance

Qualifications

AI models
Research design
Laboratory experiment design
Supplier performance analysis
MATLAB
Master's degree in physics
Requirements specification
Requirements design
Quality control statistical data analysis
Design of experiments
Statistical Process Control
Mechanical Engineering
Engineering process optimization
Reliability analysis
Mid-level
Master's degree
Doctorate in mechanical engineering
White papers
Policy & process development
Machine intelligence
Doctor of Philosophy
Master's degree in mechanical engineering
Requirements analysis
Vendor performance improvement
Prototype creation
Master's degree in applied physics
Doctoral degree in physics
Physics
Master's degree in electrical engineering
Engineering product development

Full Job Description

Job Details:

Job Description:

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 3+ years of industry experience
-OR- PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related STEM field with 1+ years of industry experience
Minimum cumulative GPA of 3.5.
Must have the required degree prior to your start date.

Experience listed above should be a combination of the following:

Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE), preferably within semiconductor or advanced manufacturing environments.

Strong experimental background, including hands-on laboratory or prototype development experience.

Experience in programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Apply Now

Refine Your Search

yield engineer jobs in arizona

Packaging Module Development Engineer

Senior Process Integration Development Engineer

Yield Excellence Engineer

Yield and Process Control Automation Engineer

Operations Research Engineer

ATD Experienced Laser Development Engineer

Ocotillo Technology Fabrication Yield Device Integration Engineer

Senior Principal RF Design Engineer

Process Engineer (Korean bilingual required)

Principal RF Design Engineer

Electrical Engineer Production Hardware – Tucson, AZ – Interim Secret

Senior RF Design Engineer

Principal Electrical Engineer - Production Hardware (3rd shift)

Sr. Electrical Engineer - Production Hardware (3rd shift)

Sr. Electrical Engineer - Production Hardware (2nd Shift)

Sr. Electrical Engineer - Production Hardware

Sr. Power Electronics Engineer

Production Support Electrical Engineer (all shifts)

Module Development Engineer - RF Test

Principal Systems Engineer - Production Maturation Lead (Onsite)

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