Top 41 Semiconductor engineer Jobs in Bellevue Wa

Semiconductor Packaging Engineer
Sigma Design —Redmond, WA
- $115,000 - $140,000 a year
- Full-time
- English
- Ability to lift 50 pounds
- Analysis skills
- Paid holidays
- Disability insurance
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Technical Support Engineer
Jama Software —Seattle, WA
- Weekends as needed
- Remote
- Computer science
- Computer Science
- Mid-level
- Paid parental leave
- Health insurance
11d
Principal Sourcing Engineer, Semiconductor Backend
Microsoft —Redmond, WA
- $142,800 - $304,200 a year
- Full-time
- Background check
- 6 years
- Engineering
14d
Controls Engineer, Amazon Leo Optical Inter-Satellite Link
Amazon Kuiper Manufacturing Enterprises LLC —Redmond, WA
- $117,300 - $160,000 a year
- Full-time
- CAD
- Bachelor of Science
- Mid-level
- AD&D insurance
- Health insurance
Avionics EEE Components Engineer III
Blue Origin —Seattle, WA
- $130,706.00 - $182,987.70 a year
- Full-time
- Background check
- 5 years
- Writing skills
- Paid parental leave
- Paid holidays
Validation DevOps Engineer
UST —Redmond, WA
- $72,000 - $108,000 a year
- Remote
- Azure
- 5 years
- DevOps
- Paid jury duty
- Health savings account
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Infrastructure Verification Engineer
TechBiz Global GmbH —Redmond, WA
- Full-time
- Remote
- Mid-level
- Analysis skills
- Linux
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Principal Applied Scientist
Siemens —Bellevue, WA
- $197,268 - $267,036 a year
- Full-time
- Hybrid work
- Mentoring
- Senior level
- Communication skills
Mechanical Engineer, Electronics Packaging, Avionics Mechanical
Amazon Kuiper Manufacturing Enterprises LLC —Redmond, WA
- $117,300 - $160,000 a year
- Full-time
- Master's degree
- Continuous improvement
- Experience equivalent to degree accepted
- AD&D insurance
- Health insurance
18h
Audio Silicon Development Engineer
Sigma Group —Redmond, WA
- $160,000 - $200,000 a year
- 6 years
- Mid-level
- Doctor of Philosophy
- Paid parental leave
- Health savings account
Senior Materials Scientist or Engineer
Interlune —Seattle, WA
- $125,000 - $250,000 a year
- Full-time
- 5 years
- Bachelor of Science
- Analysis skills
- Paid holidays
- Disability insurance
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Principal Physical Design Engineer
Microsoft —Redmond, WA
- $142,800 - $304,200 a year
- Urgently hiring
- Background check
- Doctoral degree
- Computer Science
10d
SystemC Modeling Engineer
UST —Redmond, WA
- $126,000 - $189,000 a year
- Remote
- Computer Science
- Writing skills
- Mid-level
- Paid jury duty
- Health savings account
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1d
Sr. Process Integration Engineer
Impinj —Seattle, WA
- $113,900 - $160,800 a year
- Remote
- 5 years
- Analysis skills
- Travel
- Health insurance
- Paid time off
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Senior Product Manager, AI Platform and Developer Productivity
NVIDIA —Seattle, WA
- $208,000 - $327,750 a year
- Full-time
- Hybrid work
- Computer science
- Computer Science
- Bachelor of Science
Nanofabrication Research Engineer, Optical Systems
Meta —Redmond, WA
- $154,000 - $217,000 a year
- Research
- Doctor of Philosophy
- Fair chance
Senior Silicon Test Engineer
Microsoft —Redmond, WA
- $119,800 - $261,000 a year
- Full-time
- Background check
- Doctoral degree
- Computer Science
7d
Sr. Mechanical Engineer, Electronics Packaging, Avionics Mechanical
Amazon Kuiper Manufacturing Enterprises LLC —Redmond, WA
- $137,300 - $185,700 a year
- Full-time
- Master's degree
- Mentoring
- Experience equivalent to degree accepted
- AD&D insurance
- Health insurance
18h
Senior Product Engineer, Product Engineering
Amazon Kuiper Manufacturing Enterprises LLC —Redmond, WA
- $159,200 - $247,600 a year
- Full-time
- Analysis skills
- Machine learning
- Doctor of Philosophy
- AD&D insurance
- Health insurance
SystemC Modeling Developer
UST —Redmond, WA
- $80,000 - $120,000 a year
- Remote
- Computer Science
- Mid-level
- Master's degree
- Paid jury duty
- Health savings account
Quick Apply

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semiconductor engineer jobs near bellevue wa

Semiconductor Packaging Engineer

Sigma Design -
Redmond, WA

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Job Details

Full-time
$115,000 - $140,000 a year

Benefits

Paid holidays
Disability insurance
Health insurance
Dental insurance
Paid time off
401(k) 4% Match
401(k) matching
Life insurance

Qualifications

Research design
Bachelor's degree in mechanical engineering
Laboratory experiment design
Through-hole soldering
Defect resolution root cause analysis
Chemical Engineering
Bachelor's degree in electrical engineering
Performance testing in mechanical engineering
Wearables
Thermal control
Defect analysis
Design of manufacturing processes
Materials engineering experience within manufacturing
Design of experiments
Mechanical Engineering
Engineering process optimization
Injection (injection molding)
Aerospace Engineering
Soldering tools
English
X-ray inspection of electronics
Electronic parts
Collaboration with product development teams
Analysis skills
Electronics test data analysis
Bachelor's degree in engineering
Laminating
Industrial plating
Production validation processes
Grinding

Full Job Description

Semiconductor Packaging Engineer

Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance.

Position Details:

This position will be In-Office
$115,000 - $140,000 annually
This is a contract position with an expected duration of 12 months and the opportunity to be extended.

Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes. This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across research, hardware, and manufacturing teams to improve device performance, reliability, and scalability.

Essential Job Functions - Responsibilities:

Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices.
Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies.
Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization.
Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield.
Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance.
Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions.
Support the development and use of high-performance electronic materials in advanced packaging environments.
Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments.
Follow Business Technology policies to protect sensitive data and reduce information security occurrences.

Education and Experience: (Knowledge, Skills, & Abilities)

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
Hands-on experience working with semiconductor assembly and packaging equipment
Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
Experience collaborating across research and development, hardware engineering, and manufacturing teams
Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
Experience handling and integrating thinned electronic components as part of advanced packaging workflows
Demonstrated success developing or maturing hardware research processes including instrumentation, characterization, mechanical or layout design, and/or advanced data analysis techniques
Experience developing or applying high-performance electronic materials in semiconductor or advanced packaging environments
Experience with advanced packaging domains including Flexible Printed Circuits (FPC), Multi-Chip Modules (MCM), System-in-Package (SiP), 2.5D/3D integration, Flexible Hybrid Electronics (FHE), or similar technologies preferred
Experience performing reliability testing and failure analysis including die or ball shear testing, wire pull testing, X-ray inspection, C-SAM inspection, thermal cycling, and environmental testing preferred
Experience with wearable technologies or technical soft goods preferred
Experience with hermetic or MEMS packaging, thermal management materials, or injection/transfer molding processes preferred
Experience using Finite Element Analysis (FEA) modeling or simulation tools to accelerate design and prevent failures preferred
Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred
Experience with signal integrity or power integrity simulation tools (e.g., HFSS) and validation preferred
Strong written and verbal English language communication skills
Excellent teamwork/interpersonal skills and the ability to communicate effectively
Demonstrated ability to work collaboratively, both within and outside one's own work group
Demonstrate commitment and adherence to Sigma Design Core Values
Pass a post-offer background verification

Work Environment
Standard lab/production environment. Appropriate safety garments (PPE) must be worn. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation. Occasionally may be required to travel as required to other facilities, clients, or suppliers. Must be able to stand and work as long as 12 hours in different positions. Must be able to lift up to 50 pounds unassisted.

SigmaDesign is an Equal Opportunity Employer

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Refine Your Search

semiconductor engineer jobs in bellevue wa

Semiconductor Packaging Engineer

Technical Support Engineer

Principal Sourcing Engineer, Semiconductor Backend

Controls Engineer, Amazon Leo Optical Inter-Satellite Link

Avionics EEE Components Engineer III

Validation DevOps Engineer

Infrastructure Verification Engineer

Principal Applied Scientist

Mechanical Engineer, Electronics Packaging, Avionics Mechanical

Audio Silicon Development Engineer

Senior Materials Scientist or Engineer

Principal Physical Design Engineer

SystemC Modeling Engineer

Sr. Process Integration Engineer

Senior Product Manager, AI Platform and Developer Productivity

Nanofabrication Research Engineer, Optical Systems

Senior Silicon Test Engineer

Sr. Mechanical Engineer, Electronics Packaging, Avionics Mechanical

Senior Product Engineer, Product Engineering

SystemC Modeling Developer

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