Module Development Engineer (Adv Packaging)
Intel —Hillsboro, OR
- $99,030 - $139,810 a year
- Full-time
- Mid-level
- Master's degree
- Analysis skills
- Health insurance
Packaging Engineer
International Flavors & Fragrances —Clackamas, OR
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- Full-time
- Background check
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Genentech —Hillsboro, OR
- $78,800 - $146,510 a year
- Online Application
- Bachelor of Science
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MST —Lake Oswego, OR
- Full-time
- Bachelor of Science
- Bachelor's degree
- Travel
Manufacturing Engineer II
RIVERPOINT MEDICAL LLC —Portland, OR
- Full-time
- Microsoft Word
- Microsoft Access
- Management
- Paid holidays
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Manufacturing Engineer, Reliability
BIOTRONIK SE & Co. KG —Lake Oswego, OR
- Full-time
- Bachelor of Science
- Bachelor's degree
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Quality Engineer
RIVERPOINT MEDICAL LLC —Portland, OR
- Full-time
- Microsoft Word
- Bachelor of Science
- Mid-level
- Paid holidays
- Health insurance
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Quality Engineer II
Siltronic Corporation —Portland, OR
- Ability to walk for extended periods
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Product Engineer - Tessent Design for Test (DFT)
Siemens —Wilsonville, OR
- Full-time
- Hybrid work
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- English
Sr IC Packaging Layout Specialist – (100% Remote)
Encore Semi, Inc. —Hillsboro, OR
- $150,000 - $165,000 a year
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- Remote
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Design Technology Tool Enablement Engineer
Intel —Hillsboro, OR
- $173,660 - $284,580 a year
- Full-time
- Hybrid work
- 3 years
- Master's degree
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Physical Design Methodology Engineer
Intel —Hillsboro, OR
- $164,470 - $269,100 a year
- Full-time
- Hybrid work
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- Computer Science
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Memory Circuit Design Engineer
Intel —Hillsboro, OR
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10d
Qubit Control IC Designer
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11d
Electrical Engineer (P.E.), Data Center design
Design Group —Portland, OR
- $85,000 - $120,000 a year
- Full-time
- Background check
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Mixed Signal Logic Design Engineer
Intel —Hillsboro, OR
- $141,910 - $269,100 a year
- Full-time
- Bachelor of Science
- 3 years
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Senior Testchip SoC Physical Design Engineer (Integration & Methodology)
Intel —Hillsboro, OR
- $141,910 - $200,340 a year
- Full-time
- Hybrid work
- 5 years
- Master's degree
- Senior level
- Health insurance
Analog and Mixed Signal Design Engineer
Intel —Hillsboro, OR
- $164,470 - $269,100 a year
- Full-time
- 3 years
- Master's degree
- Doctor of Philosophy
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3D Memory Chip Architect and Design, Principal Engineer
Qualcomm —Hillsboro, OR
- $192,000 - $288,000 a year
- Computer science
- Computer Science
- Engineering
8d
MANUFACTURING TECHNICIAN III
TE Connectivity —Wilsonville, OR
- $55,200 - $82,800 a year
- Mid-level
- 3 years
- High school diploma or GED
- Employee stock purchase plan
- Disability insurance
1d

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Module Development Engineer (Adv Packaging)

Intel -
Hillsboro, OR

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Job Details

Full-time
$99,030 - $139,810 a year

Benefits

Health insurance

Qualifications

Master's degree
Stakeholder management

Full Job Description

Job Details:

Job Description:

The Role and Impact

This role is responsible for driving semiconductor technology development and manufacturing enablement for both high-volume manufacturing and next-generation technologies. The successful candidate will develop process integration and equipment solutions, conduct feasibility studies, and support the development of innovative device architectures and manufacturing technologies.

Working closely with internal engineering teams and external suppliers, this individual will lead process development efforts, optimize manufacturing capabilities, and contribute to technology roadmaps that enable future product requirements. This position requires regular onsite presence to support essential business and manufacturing activities.

Key Responsibilities

Drive technology development and manufacturing enablement for current and future semiconductor technologies.
Develop process integration and equipment solutions to meet device performance, quality, and manufacturability requirements.
Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, metrology development, and system design.
Perform process technology feasibility studies using engineering analysis, simulations, and experimental methods.
Conduct pathfinding activities to support hardware and process development for emerging device architectures.
Develop technology roadmaps that support future manufacturing and product requirements.
Identify and implement process and equipment improvements to increase production efficiency, manufacturing capability, and overall output.
Collaborate with equipment and material suppliers to develop and implement enabling technologies.
Evaluate manufacturing trends, emerging technologies, and industry developments to identify opportunities for future process innovation.
Partner with cross-functional teams to support technology transfer, process qualification, and manufacturing ramp activities.

Behavioral Skills

Strong technical problem-solving and analytical skills.
Ability to lead and influence cross-functional teams in a highly collaborative environment.
Effective verbal, written, and presentation communication skills.
Strong organizational skills with the ability to manage multiple priorities simultaneously.
Demonstrated ability to drive results in fast-paced and technically complex environments.
Ability to work independently while maintaining strong stakeholder alignment.
Adaptability and willingness to learn new technologies, processes, and methodologies.

Qualifications:

Minimum Qualifications:

Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline
1+ years of experience utilizing Statistical Process Control (SPC) and/or Design of Experiments (DOE) methodologies.

Preferred Qualifications:

1+ years of experience in semiconductor technology development.
1+ years of experience delivering results for complex, time-sensitive technical projects.
1+ years of experience with semiconductor fabrication processes and manufacturing technologies.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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MANUFACTURING TECHNICIAN III

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