As the largest pureplay adhesives company in the world, H.B. Fuller’s (NYSE: FUL) innovative, functional coatings, adhesives and sealants enhance the quality, safety and performance of products people use every day. Founded in 1887, with 2024 revenue of $3.6 billion, our mission to Connect What Matters is brought to life by more than 7,500 global team members who collaborate with customers across more than 30 market segments in over 140 countries to develop highly specified solutions that enable customers to bring world-changing innovations to their end markets. Learn more at www.hbfuller.com.
Location: Norcross, Georgia
What you will do:
Design, develop, test, and evaluate integrated systems for advanced electronics manufacturing, packaging, and assembly technologies.
Bring advanced electronics manufacturing, packaging, and assembly technologies to commercial readiness including Optoelectronics Assembly, MEMS Packaging, Microelectronics Packaging, and Electronics Packaging.
Planning and establishing sequence of operations to fabricate and assemble parts or products and to promote efficient utilization.
Conduct process technology synthesis, process design, process development, process control/quality, calibration, process capability analysis, test, measurement maintenance and assembly.
Synthesis of new process technologies, manufacturing solutions, production systems, process tools, and material solutions.
Obtain customer requirements and translate those into proposals and communicate to the project team responsible for delivering solution to the customer.
Coordinating jetting and printing process development and characterization for new products.
Conducting reliability and environmental testing including ThermoCycling, 85/85, Highly Accelerated Stress Test, Surface Insulation Resistance, Thermomechanical Analysis, and Dynamic Mechanical Analysis.
Testing vehicles assembly and preparation for mechanical, electrical, or application testing.
Designing experiments in applications for correct material development.
Conferring with clients, vendors, staff, and management personnel regarding purchases, product and production specifications, manufacturing capabilities, or project status.
Ensuring products meet customer's statement of work for material and process acceptance criteria.
Utilize the following tools and technologies: ASMPT DEK Horizon, Galaxy and TQ platforms, DEKPro, Galaxy platforms, Panasonic and Siplace pick and place machines, Heller Technologies, Koh Young optical inspection, Ersa selective soldering, laser and mechanical bit boards depaneling, Asymtek and Mycronic jetting machines (Spectrum, Forte, Quantum), GC Prevue, Minitab Statistical software, Agile, SAP, and Valor PCB software.
Position requires domestic and foreign travel up to 20% as needed and customary for the occupation.
Position Requirements:
The position requires a Bachelor's degree or foreign equivalent degree in Industrial Engineering, Mechanical Engineering, or closely related field.
The qualified candidate must have at least 2 years (24 months) of experience in a process/product engineer position or closely related occupation.
The qualified candidate must also have at least 2 years (24 months) of experience with all of the following: (a) process development and equipment qualification for new products; (b) performing process characterization for validation plans execution; (c) developing end-to-end processes and documentation for product introduction as risk management, control plan, PFMEA, SOP, MPI, manufacturing layout; (d) working with customers and suppliers for correct new technologies development according to the new product requirements; (e) coordinating the execution of process and product engineering activities related to new product introduction; (f) synthesizing new process technologies, manufacturing solutions, production systems, process tools and consumable material solutions; and (g) utilizing the following tools and technologies: ASMPT DEK Horizon, Galaxy and TQ platforms, DEKPro, Galaxy platforms, Panasonic and Siplace pick and place machines, Heller Technologies, Koh Young optical inspection, Ersa selective soldering, laser and mechanical bit boards depaneling, Asymtek and Mycronic jetting machines (Spectrum, Forte, Quantum), GC Prevue, Minitab Statistical software, Agile, SAP, and Valor PCB software.
All experience may be gained concurrently.
Pay is based on several factors including but not limited to education, work experience, certifications, and geographic location.
The salary for this role is $85,218.
In addition to your salary, H.B. Fuller offers employees a competitive total rewards package including comprehensive benefits, incentive and recognitions programs, health & wellness benefits, 401K contributions, paid time off and paid holidays. Eligibility may vary.
H.B. Fuller is an Equal Employment Opportunity employer and proud to have created a collaborative culture where employees around the world are seen, heard, and respected. All qualified applicants will receive consideration for employment without regard to race, color, age, religion, sex, sexual orientation, gender identity or expression, national origin, disability, or marital status or status as a protected veteran, or any other legally protected classification.
H.B. Fuller does not accept unsolicited resumes from recruiters, employment agencies, or staffing firms. To conduct business with H.B. Fuller, a written service agreement must be executed by Human Resources prior to submitting any information relating to a potential candidate. Without a signed service agreement, H.B. Fuller shall not be obligated for payment of any fee or compensation.
