Top 6 Hfss Jobs in Orlando, Fl

Package Design Engineer | Semiconductor
Micross —Apopka, FL
- Full-time
- 8 years
- Organizational skills
- Senior level
- Health savings account
- Paid holidays
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Semiconductor Package Design Engineer
Micross —Apopka, FL
- 8 years
- Organizational skills
- Senior level
- Health savings account
- Paid holidays
Quick Apply
Mgr, Design Engineering
Qorvo —Apopka, FL
- Research
- 3 years
- Master's degree
Staff Design Engineer
Qorvo —Apopka, FL
- Schematics
- 3 years
- Master's degree
Sr RF Design Engineer - Modules
Qorvo —Apopka, FL
- Full-time
- Doctor of Philosophy
- Product management
- Senior level
Signal & Power Integrity Electrical Engineer, Sr - Orlando, FL
Lockheed Martin Corporation —Orlando, FL
- Full-time
- 5 years
- Master's degree
- Mentoring
- Paid jury duty
- Paid holidays

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Package Design Engineer | Semiconductor
Micross —Apopka, FL
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates.
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Semiconductor Package Design Engineer
Micross —Apopka, FL
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates.
Quick Apply

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Radio Frequency (RF) Engineer Lead
Battelle —Columbus, OH
Communicate complex technical concepts clearly to both technical and non-technical audiences. Design and develop RF/microwave systems, subsystems, and…

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Package Design Engineer | Semiconductor

Micross -
Apopka, FL

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Job Details

Full-time

Benefits

Health savings account
Paid holidays
Health insurance
Dental insurance
Flexible spending account
Tuition reimbursement
Employee assistance program
Vision insurance
401(k) matching
Life insurance
Pet insurance

Qualifications

Bachelor's degree in mechanical engineering
Capacitors
Requirements design
Bachelor's degree in electrical engineering
Mechanical Engineering
CAD design (engineering design task)
8 years
SoC
Bachelor's degree in engineering
Requirements analysis
Design engineering
Organizational skills
Document archiving
Engineering product development
Simulation tools
Packaging design
Senior level
Documentation Handling
Electrical Engineering
Cross-functional collaboration
Electrical optimization
Communication skills
Cross-functional communication

Full Job Description

Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility.

Essential Duties and Responsibilities:

The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates
Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
Work with IC design team to define IC package requirements
Design package layout using standard CAD tools
Extract package parasitics and conduct PI/SI analysis
Documentation and release in appropriate archival system

Preferred Knowledge, Skills, And Abilities

Layout:

Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.

Analysis:

Celsius PowerDC (IR Drop)
Sigrity Advanced SI II: Analysis tools for Signal integrity of parallel busses (DDRx) and serial links (PCIe Gen x), including Package and PCB effects
Sigrity Advanced PI II: Power Integrity tools (IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects

RF / Microwave Design

AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development

Qualifications

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline.
8 to 10 years of experience in semiconductor packaging design, modeling, and simulations
Strong authority on Cadence Allegro Package Designer Plus (APD+)
Experience on interposer and substrate layouts and design in advanced package technologies
Experience with 2.5D, 3D package design
Experience with design teams on floor plan, bump and layout optimization
Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated
Record of success in cross-functional team environment
Good experience with SI/PI tools for package level extraction/simulation

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.

www.Micross.com

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hfss jobs in orlando, fl

Package Design Engineer | Semiconductor

Semiconductor Package Design Engineer

Mgr, Design Engineering

Staff Design Engineer

Sr RF Design Engineer - Modules

Signal & Power Integrity Electrical Engineer, Sr - Orlando, FL

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