Packaging Module Development Engineer
Intel —Phoenix, AZ
- $133,800 - $188,890 a year
- Full-time
- Mid-level
- Analysis skills
- Doctor of Philosophy
- Health insurance
13d
Ocotillo Technology Fabrication Wet Etch Module Engineer
Intel —Phoenix, AZ
- $89,010 - $146,440 a year
- Full-time
- Senior level
- Electrical Engineering
- Leadership
- Disability insurance
- Health insurance
7d
Ocotillo Technology Fabrication Litho Resist Track Module Engineer
Intel —Phoenix, AZ
- $103,730 - $198,820 a year
- Full-time
- Management
- Doctor of Philosophy
- Mentoring
- Health insurance
Yield Excellence Engineer
TSMC —Phoenix, AZ
- Monday to Friday
- Mid-level
- US work authorization
- Electrical Engineering
Quick Apply
Yield and Process Control Automation Engineer
Intel —Phoenix, AZ
- $149,600 - $284,580 a year
- Full-time
- 7 years
- Computer Science
- Master's degree
- Health insurance
Product Engineer (Yield & Quality)
TSMC —Phoenix, AZ
- Mid-level
- Master's degree
- Travel
Quick Apply
Package Failure Analysis Engineer
Intel —Phoenix, AZ
- $85,200 - $139,810 a year
- Full-time
- Mid-level
- Analysis skills
- Electrical Engineering
- Health insurance
Ocotillo Technology Fabrication Yield Device Integration Engineer
Intel —Phoenix, AZ
- $103,730 - $198,820 a year
- Full-time
- 3 years
- Analysis skills
- Doctor of Philosophy
- Health insurance
6d
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Annapurna Labs (U.S.) Inc. —Tempe, AZ
- $159,200 - $247,600 a year
- Full-time
- Master's degree
- Mentoring
- Fair chance
- AD&D insurance
- Health insurance
ATD MIHL Equipment Development Engineer
Intel —Phoenix, AZ
- $115,110 - $188,890 a year
- Full-time
- Mid-level
- Master's degree
- Doctor of Philosophy
- Health insurance
6d
Operations Research Engineer
Intel —Phoenix, AZ
- $149,600 - $211,200 a year
- Full-time
- Mid-level
- Master's degree
- SQL
- Health insurance
Module Engineering - Day Shift 5 or 7
Intel —Phoenix, AZ
- $85,200 - $162,500 a year
- Full-time
- Master's degree
- Assembly
- 1 year
- Health insurance
2d
Silicon Packaging Design Engineer
Intel —Phoenix, AZ
- $105,650 - $200,340 a year
- Full-time
- Mid-level
- Master's degree
- 1 year
- Health insurance
Ocotillo Technology Fabrication Process Integration and Yield Engineer
Intel —Phoenix, AZ
- $103,730 - $198,820 a year
- Full-time
- Mid-level
- Master's degree
- SQL
- Health insurance
[Fall 2025/Spring 2026] TSMC Engineering Career Opportunities (US Locations)
TSMC —Phoenix, AZ
- Full-time
- Azure
- Construction site
- Research
Quick Apply
MMIC Design Engineer
Viasat, Inc. —Tempe, AZ
- $120,500 - $224,500 a year
- Online Application
- Mid-level
- 3 years
- Master's degree
6d
Packaging Process Engineer – Microdisplay
Snapchat —Chandler, AZ
- $121,000 - $214,000 a year
- Full-time
- Hybrid work
- 7 years
- Bachelor of Science
- Mid-level
- Paid parental leave
- Health insurance
TD Media and Collaterals Development Engineer
Intel —Phoenix, AZ
- $115,110 - $162,500 a year
- Full-time
- Bachelor of Science
- Research
- Mid-level
- Health insurance
FCO Functional Area Industrial Engineer
Intel —Phoenix, AZ
- $103,730 - $198,820 a year
- Full-time
- Hybrid work
- Master's degree
- SQL
- Bachelor's degree
- Health insurance
Advanced Manufacturing Engineer Senior
Honeywell Aerospace —Phoenix, AZ
- Full-time
- Manufacturing
- Senior level

I want to receive the latest job alert for yield engineer in phoenix, az

By signing in to your account, you agree to SimplyHired's Terms of Service and consent to our Cookie and Privacy Policy.

Explore jobs in more locations

yield engineer jobs near phoenix, az

Packaging Module Development Engineer

Intel -
Phoenix, AZ

Apply Now

Job Details

Full-time
$133,800 - $188,890 a year
13 days ago

Benefits

Health insurance

Qualifications

Performance testing in mechanical engineering
Quality control statistical data analysis
Design of experiments
Statistical Process Control
Industrial equipment adjustment
Monitoring processing parameters
Equipment adjustment (production tasks)

Full Job Description

Job Details:

Job Description:

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies. Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements. As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology. Be part of a dynamic environment where your expertise and creativity will make a meaningful impact on Intel's success and leadership in the semiconductor industry.

Key Responsibilities

Develop and optimize advanced packaging processes and equipment to support Intel's Glass Core and CPO roadmap.
Define and implement process specifications, equipment configurations, and workflows for new technologies, ensuring seamless integration into manufacturing.
Apply design of experiments (DOE) principles to characterize process windows and understand the interactions between equipment, materials, and processes.
Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress environments.
Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet strict quality standards.
Lead efforts to develop innovative techniques, tools, and methods to accelerate technology readiness and identify risks early in the development cycle.
Document advancements through white papers, technical reports, and data analysis.
Partner with cross-functional engineering teams and external stakeholders to address packaging challenges and align solutions with Intel's strategic goals.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field.
+4 years of experience in:
- Process development, equipment adjustment, and manufacturing process control.
- Design of experiments (DOE) principles and statistical data analysis.
- Process characterization and statistical process control methodologies.
- Material testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.

Preferred Qualifications

Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
Analytical skills and experience troubleshooting integrated technology challenges.
Advanced statistical tools, process control frameworks, and Microsoft Office software suite applications.
Experience working with both organic and inorganic materials in packaging processes.
1 year of Photolithography experience.

Join Intel's mission to innovate and lead in the field of advanced packaging technologies. Apply now to become part of the team shaping the future of semiconductor manufacturing.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Apply Now

Refine Your Search

yield engineer jobs in phoenix, az

Packaging Module Development Engineer

Ocotillo Technology Fabrication Wet Etch Module Engineer

Ocotillo Technology Fabrication Litho Resist Track Module Engineer

Yield Excellence Engineer

Yield and Process Control Automation Engineer

Product Engineer (Yield & Quality)

Package Failure Analysis Engineer

Ocotillo Technology Fabrication Yield Device Integration Engineer

Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging

ATD MIHL Equipment Development Engineer

Operations Research Engineer

Module Engineering - Day Shift 5 or 7

Silicon Packaging Design Engineer

Ocotillo Technology Fabrication Process Integration and Yield Engineer

[Fall 2025/Spring 2026] TSMC Engineering Career Opportunities (US Locations)

MMIC Design Engineer

Packaging Process Engineer – Microdisplay

TD Media and Collaterals Development Engineer

FCO Functional Area Industrial Engineer

Advanced Manufacturing Engineer Senior

I want to receive the latest job alert for yield engineer in phoenix, az

Related Searches

Explore jobs in more locations

Job Details:

Job Description:

Qualifications:

Job Type:

Shift:

Primary Location:

Additional Locations:

Business group:

Posting Statement:

Position of Trust

Benefits

Job Seeker Tools

Employer Tools

Browse

Stay Connected