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Packaging Module Development Engineer

Intel -
Phoenix, AZ

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Job Details

Full-time
$115,110 - $219,550 a year
14 days ago

Benefits

Health insurance

Qualifications

Optics
Design of individual components

Full Job Description

Job Details:

Job Description:

Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with packaging assembly module teams, package architecture, integration, and assembly, substrate, an optical component materials supply chain, as well as semiconductor vendors and assembly/test providers worldwide. The position requires a strong understanding of optical materials and assembly process, optical component design, manufacturing, and test, active optical alignment processes. This role spans across pathfinding through high volume manufacturing for successful integrated co-packaged optics packages.

In this role, the individual will be responsible for, but not limited to:

Conducting fundamental studies and performing experiments to characterize materials, identify potential failure modes, understand the structure-property-performance interactions, assess feasibility of material use on product, and make material technology recommendations.
Working in close collaboration with materials suppliers to develop and source materials formulations that meet technology, quality, availability, and cost targets.
Developing a fundamental understanding of Intel's assembly process and materials interactions and impact on product performance.
Collaborating closely with Materials, equipment and process engineering teams to build material technologies on test vehicles and products and assessing their performance.
Develops materials assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Develops new techniques and metrologies, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.

The candidate should also exhibit the following behavioral traits and/or skills:

Technical problem-solving, strong presentation and communication skills, fast-learning skills and solid expertise in their technical field, willingness to collaborate effectively as a team player across multiple teams.

Qualifications:

Minimum Qualifications:

Candidates must possess a MS with 3+ years of experience or PhD degree and with 1+ years of work experience post-graduation. Graduate degree discipline can be in Optics or Photonics Engineering, Materials Sci Eng related to Photonics, Applied Physics, Chemical Engineering, or related fields.

Preferred Qualifications:
1+ years of experience in one or more of the following:

Semiconductor packaging and optical assembly experience
Optical connector/component design and manufacturing experience
Experience in photolithography materials and process
Ceramics, glass processing

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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metrology engineer jobs in phoenix az

Packaging Module Development Engineer

Senior Yield Engineer – Substrate & Advanced Packaging

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Application Engineer III - EBeam

Gas Analyzer Specialist

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Technologist, Advanced Packaging Director

Associate Process Engineer

Foundry Customer Integration Engineer

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Foundry Customer NPI Integration Engineer

Substrate Supplier Enablement Engineer

Sr. Applications Engineer (Metrology)

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Senior Foundry Device Engineer

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Principal Process Engineer

Principal Engineer, Surface Technology (Surface Modification)

Engineer I, Field Process

Senior Application Engineer

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