Top 48 Principal device design engineer Jobs in Phoenix Az

Principal PCB & Substrate Layout Engineer
Belcan —Phoenix, AZ
- $98 an hour
- Contract
- Engineering
- Experience equivalent to degree accepted
- Senior level
- Paid holidays
- Health insurance
Quick Apply
10d
Advanced ASIC FPGA Engineer- (Sign-on Bonus Available)
General Dynamics Mission Systems, Inc —Scottsdale, AZ
- $122,785 - $136,215 a year
- Full-time
- Hybrid work
- Data analysis skills
- Research
- 3 years
Sr Principal ASIC FPGA Engineer (Sign-on Bonus Available)
General Dynamics Mission Systems, Inc —Scottsdale, AZ
- $182,139 - $202,060 a year
- Full-time
- Hybrid work
- Research
- Master's degree
- 8 years
- Paid parental leave
- Health insurance
Principal R&D Engineer - Medical Device Process Development
Entegee —Tempe, AZ
- Up to $75 an hour
- Full-time
- 5 years
- Engineering
- Fair chance
- Commuter assistance
- Disability insurance
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8d
Sr Principal Aeronautical Engineer (Level 4)
Northrop Grumman —Chandler, AZ
- $122,800 - $184,200 a year
- 8 hour shift
- 6 years
- Bachelor of Science
- Master's degree
- Paid holidays
- Disability insurance
Principal Device Design Engineer
Renesas Electronics —Tempe, AZ
- Full-time
- Remote
- 7 years
- Doctor of Philosophy
- Senior level
Quick Apply
Principal Product Designer
Bezos Academy —Phoenix, AZ
- $157,000 - $298,000 a year
- Email
- Remote
- Analysis skills
- Preschool
- Bachelor's degree
- Paid parental leave
- Paid holidays
(Senior / Principal) Engineer, Global Product Support
ASM International —Phoenix, AZ
- Full-time
- Engineering
- Analysis skills
- Doctor of Philosophy
Principal Engineer, Digital Design Engineer (AI/ML)
Analog Devices —Chandler, AZ
- Day shift
- Analysis skills
- Doctor of Philosophy
- Travel
Principal Power IC Design Engineer
Analog Devices —Chandler, AZ
- Day shift
- Analysis skills
- Doctor of Philosophy
- Travel
Design Engineer
onsemi —Scottsdale, AZ
- Online Application
- Master's degree
- Senior level
- Electrical Engineering
Principal Engineer, Digital Verification Engineering
Analog Devices —Chandler, AZ
- Full-time
- Master's degree
- Analysis skills
- Doctor of Philosophy
Principal Electrical Engineer
Mercury Systems —Phoenix, AZ
- $87,100 - $215,800 a year
- Full-time
- Hybrid work
- 6 years
- Analysis skills
- Team management
- Employee stock purchase plan
- Paid holidays
Principal Engineer, Systems Engineering (Systems and Mechanical Engineering – Electrostatic Chuck (ESC))
ASM International —Phoenix, AZ
- Full-time
- Doctor of Philosophy
- Senior level
- Electrical Engineering
Architectural Coordinator
Taylor Morrison —Phoenix, AZ
- Full-time
- Microsoft Excel
- Microsoft Outlook
- Computer literacy
- Disability insurance
- Health insurance
Principal Process/Device Engineer
Renesas Electronics —Chandler, AZ
- Full-time
- Mentoring
- Senior level
- Communication skills
Quick Apply
1d
Principal Engineer, Electrical Engineering – Advanced Packaging
ASM International —Phoenix, AZ
- Full-time
- Master's degree
- Mentoring
- Senior level
Integration and Test Principal Aeronautical Engineer
Northrop Grumman —Chandler, AZ
- $98,400 - $147,600 a year
- 8 hour shift
- Bachelor of Science
- Travel
- Senior level
- Paid holidays
- Disability insurance
Principal Software Engineer
Moove —Phoenix, AZ
- Hybrid work
- Computer Science
- System design
- Bachelor's degree
12d
Principal Engineer, Applications
onsemi —Scottsdale, AZ
- Online Application
- Laboratory experience
- English
- 8 years

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principal device design engineer jobs near phoenix az

Principal PCB & Substrate Layout Engineer

Belcan -
Phoenix, AZ

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Job Details

Contract
$98 an hour
10 days ago

Benefits

Paid holidays
Health insurance
Dental insurance
401(k)
Paid time off
Vision insurance
Life insurance

Qualifications

3D modeling software
3D modeling for product design
Printed circuit board (PCB) layout

Full Job Description

Job Title: Principal PCB & Substrate Layout Engineer
Pay Rate: $98/hr.
Location: Phoenix, AZ
Zip Code: 85034
Job Type: Contract
Job Duration: 7 Months
Schedule and Shift: 9-80 A|1st Shift|09:00 AM|N
Keyword's: #Phoenixjobs; #PrincipalPCBjobs; #SubstrateLayoutEngineerjobs; #INDSUB
Start Date: Immediate

We provide a competitive pay and benefits package. This position is offering a pay rate of $98/hr. however, Belcan considers several factors when extending an offer, including but not limited to education, experience, geographic location, and discipline. Benefits offered may include health care, dental, vision, life insurance; 401(k); education assistance; paid time off including PTO, holidays, and any other paid leave required by law.

Job Summary: Principal PCB & Substrate Layout Engineer
Our client"s Microsystems business is seeking an experienced Principal PCB & Substrate Layout Engineer to join our growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation"s defense. Client sits at the intersection of high-tech and defense - we are focused on accelerating innovations that matter to the aerospace, defense, and space sectors. We leverage our longstanding strategic partnerships to access the latest in commercial technologies to design, manufacture, test, and deliver rugged microelectronics that operate in the harshest environments, with extreme reliability and maintainability. Client partners closely with the U.S. government delivering onshore trusted microelectronics.

You are responsible for:
Providing technical leadership to the engineering team specifically focused on High-Speed Interfaces and High Density Substrates layout techniques and understanding and improving our layout development processes to ensure we produce quality products using your expertise in PCB and Substrate layout engineering.

Responsibilities:

Driving design, layout, and analysis of complicated electrical and mechanical systems and their constituent parts including: high-density interposers, substrates, and printed circuit board (PCB) layouts. This includes power, digital, analog, and RF signals across multiple die (primarily flip-chip)
Hands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.
Understand Design For Manufacturing rules of our suppliers and ensure design process matches their capabilities
Understand and provide fabrication drawings that match the intent of the design and support the fabrication suppliers to ensure the technical intent is transferred successfully
Support package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant
Work with peers and the engineering team to review the artwork and drawings at different stages and at the final design review for fabrication and assembly
Provide support for multidisciplinary investigations and feasibility studies with collaboration across engineering disciplines
Provide Technical guidance for interfacing to customers, subcontractors, assemblers, fabricators, and vendors/suppliers, operations, quality, supply chain, and supporting organizations
Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors
Considers the effects of actions on the system as a whole, i.e. 'systems-thinking'
Willing to help the team in areas outside of specific technical discipline to accomplish goals

You will be a part of:
The team responsible for the rapid development of affordable, chip-scale, secure, open system architecture devices. This leading-edge capability also addresses a need by the Department of Defense (DoD) for made-in-USA microelectronics that equip our warfighters with state-of-the-art, Trusted, military-grade products that leverage the most advanced commercial technologies..

To succeed in this role, you should have the following skills and experience:

Minimum Education: Bachelor's Degree in Engineering or equivalent education and experience required
Minimum Experience: 10+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+
Experience with APD+ physical and electrical constraint editor
HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below
Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques
Experience using a Cadence schematic / netlist driven CAD layout process, e.g. Cadence APD+ (Allegro) and supporting tools
High-end FPGA package or board design experience
Ability to work with our Mechanical team to design full 3D models for fit checks and thermal
Understanding of layout techniques in Digital, Analog, and/or RF layouts
Knowledge of electronic packaging techniques
Experience using a CAM package for manufacturing data validation. Knowledge of CAM350 & Blueprint is preferred
Working knowledge of JEDEC /IPC design, fabrication, and assembly specifications
Experience creating assembly documentation and fabrication deliverables per company and industry standards
Must be a US Person
Work effectively individually and as part of a team
Embrace the company culture that includes the following values and behaviors:

o Teamwork, execution, and communication

Belcan is an equal opportunity employer. Your application and candidacy will not be considered based on race, color, sex, religion, creed, sexual orientation, gender identity, national origin, disability, genetic information, pregnancy, veteran status or any other characteristic protected by federal, state or local laws.

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Refine Your Search

principal device design engineer jobs in phoenix az

Principal PCB & Substrate Layout Engineer

Advanced ASIC FPGA Engineer- (Sign-on Bonus Available)

Sr Principal ASIC FPGA Engineer (Sign-on Bonus Available)

Principal R&D Engineer - Medical Device Process Development

Sr Principal Aeronautical Engineer (Level 4)

Principal Device Design Engineer

Principal Product Designer

(Senior / Principal) Engineer, Global Product Support

Principal Engineer, Digital Design Engineer (AI/ML)

Principal Power IC Design Engineer

Design Engineer

Principal Engineer, Digital Verification Engineering

Principal Electrical Engineer

Principal Engineer, Systems Engineering (Systems and Mechanical Engineering – Electrostatic Chuck (ESC))

Architectural Coordinator

Principal Process/Device Engineer

Principal Engineer, Electrical Engineering – Advanced Packaging

Integration and Test Principal Aeronautical Engineer

Principal Software Engineer

Principal Engineer, Applications

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