Top 2 3d developer Jobs in portland or

SW Engineer Package Layout Design 3D-IC Solutions
Siemens —Wilsonville, OR
- $197,700 a year
- Full-time
- Hybrid work
- 5 years
- Office
- Master's degree
Senior AR/VR Software Engineer
BadVR —United States
- $90,000 - $110,000 a year
- Nights as needed
- Hybrid work
- Background check
- Computer science
- Computer Science
- AD&D insurance
- Paid holidays
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Senior AR/VR Software Engineer
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Solid understanding of data structures, algorithms, object-oriented design and design patterns. Creating data structures, algorithms, OOP, and design patterns.
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Senior AR/VR Software Engineer
BadVR —United States
Solid understanding of data structures, algorithms, object-oriented design and design patterns. Creating data structures, algorithms, OOP, and design patterns.
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SW Engineer Package Layout Design 3D-IC Solutions

Siemens -
Wilsonville, OR

Apply Now

Job Details

Full-time
$197,700 a year

Qualifications

Verification (System development task)
Tooling
Automation software
Master's degree
Programming languages
Design engineering
Packaging design

Full Job Description

Siemens EDA is a global technology leader in Electronic Design Automation (EDA) software, dedicated to pushing the boundaries of semiconductor design. As a Software Engineer, you will contribute to developing innovative software products and comprehensive workflow solutions for advanced 2.5D and 3D System-in-Package (SIP) designs. Your work will involve integrating Siemens’ industry-leading EDA and MCAD tools to facilitate architectural planning, physical design/verification, multi-die analysis (electrical, thermal, mechanical stress), and manufacturing test, making a significant impact on the future of chip design.

Responsibilities:

Drive the integration and seamless workflow between physical design and 3D-IC planning tools for complex, multi-die advanced packaging designs.
Develop, document, and champion methodologies for constructing chiplet designs within physical implementation environments and effectively integrating them into 3D-IC planning platforms.
Create and integrate substrate/package designs using advanced package layout tools, ensuring smooth transfer and assembly within 3D-IC planning environments.
Perform complex 3D assembly of chiplets and packages within 3D-IC planning tools and execute comprehensive verification to ensure LVS (Layout Versus Schematic) and DRC (Design Rule Check) cleanliness.
Develop robust scripts and automation solutions using Python, Tcl/Tk, Bash, or similar languages to enhance design efficiency, streamline workflows, and improve tool interoperability.
Act as a technical expert, providing guidance, support, and best practices to internal teams and potentially key customers. This includes understanding user needs, demonstrating solutions, and contributing to technical documentation.
Diagnose and resolve complex technical issues related to tool integration, advanced packaging methodologies, and verification challenges.
Keep abreast of the latest advancements in advanced packaging, 3D-IC technologies, and explore the application of Artificial Intelligence (AI) to optimize design flows and verification processes.

Required Skills:

Master’s degree in electrical engineering, Computer Engineering, or a closely related technical field with 5+ years of relevant industry experience.
Demonstrated hands-on expertise with advanced packaging design tools, including a strong working knowledge of building 3D packages.
Proficiency in scripting and software development using Python, Tcl/Tk, Bash, or similar languages for automation and workflow customization.
Strong understanding of advanced packaging design principles and methodologies.
Experience with industry-leading physical implementation/Place & Route tools and 3D-IC planning/integration tools.
Working knowledge of advanced package layout design tools (e.g., for substrate/package design).
Familiarity with 3D verification tools for LVS and DRC in 3D-IC environments.
Strong problem-solving abilities and a proactive approach to identifying and resolving technical challenges.
Excellent communication skills, both written and verbal, with the ability to articulate complex technical concepts to diverse audiences.
Ability to work independently and collaboratively in a fast-paced, dynamic environment.

Preferred Skills:

Direct experience with Package Design tools (e.g., Cadence APD/SiP, Siemens Xpedition) and Package / Interposer planning solutions (e.g., Siemens Innovator 3D IC, Cadence Integrity/Innovus, Synopsys 3DIC Compiler).
Familiarity with the application of Artificial Intelligence (AI) in EDA workflows, particularly in areas like design optimization, verification, or methodology development.
Knowledge of advanced process nodes and their implications for advanced packaging.
Familiarity with IC analysis tools such as Siemens HyperLynx, Ansys HFSS and Redhawk, Cadence Voltus, or Synopsys PrimeTime for signal and power integrity analysis in physical design.
Understanding of multi-physics analysis relevant to advanced packaging, including signal integrity (SI), power integrity (PI), DC drop analysis, thermal analysis, and thermo-mechanical stress analysis.
Experience with version control systems (e.g., Perforce/P4, Git), product lifecycle/data management (PLM/IPLM) systems and agile development methodologies.

Why us?

Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software. A collection of over 377,000 minds building the future one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!

Siemens Software. Transform the Everyday with Us

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109,800 197,700 5-8

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