Date: Jul 23, 2026
Location: Rochester, NY, US
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Company: Carestream Health
Innovation that sparks imagination. Continue on to your next challenge with us.
Carestream is a worldwide provider of medical imaging systems and solutions; x-ray imaging systems for non-destructive testing; manufacturing of film and precision contract coating services for a wide range of industrial, medical, electronic and other applications—all backed by a global service and support network. Carestream’s diagnostic imaging technology systems are at work in 90 percent of hospitals worldwide.
At Carestream, we offer a global perspective and a world of opportunities for people who have the desire to make a positive impact. Join our global team!
Compensation: $119,200 - $158,900 per year
- This range reflects Carestream’s good faith estimate to pay fairly as starting wage. Offers will be tailored within the range based on the selected candidate’s experience, industry knowledge, technical and communication skills, and other factors that may prove relevant during the interview process, as well as geographic market differentials for the position.
Position Summary:
The NDT Principal Electrical Engineer is a senior-level technical contributor responsible for leading the design, development, testing, and implementation of electrical systems and products within an R&D environment. This person owns the end-to-end development of electrical subsystems for next generation digital radiographic equipment. The NDT Principal Electrical Engineer independently leads intricate engineering designs from concept through commercialization, with a focus on battery systems, PCB and harness design, and system integration. This position collaborates closely with other team members including mechanical, firmware, manufacturing, and supplier partners to deliver robust, manufacturable designs that meet performance, safety, and regulatory expectations.
Position Responsibilities:
Design and develop analog and digital circuits for digital radiographic detectors.
Create schematics, PCB layouts, and supporting documentation.
Perform board bring-up, testing, debugging, and validation.
Collaborate with firmware/software engineers on embedded systems integration.
Support manufacturing, including troubleshooting, root cause analysis, and continuous improvement.
Troubleshoot and diagnose a broad range of electrical issues in both released products and in development hardware; perform root cause analysis and corrective actions.
Design harnesses (conventional wire and flex), including connector/terminal selection, wire gauge/safety considerations, strain relief, and documentation.
Collaborate with suppliers and procurement team on fabrication, test, DFM/DFT feedback, first articles, and component obsolescence mitigation; resolve build and test issues swiftly.
Generate clear design documentation (requirements, specifications, drawings, BOMs, etc.) ensuring traceability and compliance.
Contribute to system architecture, including new data path concepts for imaging systems; participate in IP development and review as appropriate.
Required Skills & Education:
Bachelor of Science in Electrical Engineering, Electronics Engineering, Computer Engineering or any related STEM field.
Minimum 10 years of hands-on electrical engineering experience, serving as the technical lead for the electrical systems on 3-5 products from concept to production.
Experience with end‑to‑end circuit board design: schematic capture, PCB design/layout, cabling/harnessing, component selection, documentation and support of QA V&V and production release activities.
Comprehensive technical knowledge of embedded microprocessor design and integration for ARM Cores, DDR memory interfaces.
Expertise in executing subsystem and system-level test plans, using lab equipment (oscilloscopes, logic analyzers) to identify and resolve critical hardware defects.
Practical prototyping experience with hands‑on fabrication and assembly of prototype PCBs, wiring harnesses, and test fixtures to support feasibility evaluations.
Working knowledge of Microsoft Visio for Electrical drawings and documentation
Desired Skills:
NDT product experience
Proficiency in PCB design (schematic and layout).
Experience with mixed-signal systems, low-noise design, or imaging/sensor electronics.
Strong analytical troubleshooting and problem‑solving skills using lab equipment (oscilloscopes, logic analyzers, electronic loads).
Familiarity with wireless technologies (e.g., Bluetooth, Wi‑Fi) as applied to embedded/medical systems.
Experience with firmware development (C/C++).
Experience with FPGA design (VHDL/Verilog).
Knowledge of general radiography and fluoroscopy—theory of operation and key system components.
Familiarity with safety standards IEC 60601‑2‑54 (X‑ray equipment for radiography and radioscopy) and IEC 60601‑2‑43 (X‑ray equipment for interventional procedures).
Practical soldering skills down to 0402 package size (rework and prototype builds).
Work Environment:
Traditional Office Environment: This position is primarily an office setting with standard temperature and humidity controls, moderate to light noise, fluorescent lighting, primarily sitting with standing desks available, extensive computer and keyboard use, etc.
Physical Requirements:
Carestream is an Equal Opportunity Employer
Carestream is an equal opportunity organization. We recruit, employ, train, compensate, and promote without regard to race, religion, creed, color, national origin, age, gender, sexual orientation, gender identity, marital status, disability, veteran status, or any other basis protected by applicable federal, state or local law.
Applying for a job with Carestream
All applicants must complete the on-line application process. Carestream is committed to working with and providing reasonable accommodations to individuals with disabilities. If you require assistance or an accommodation because of a disability to participate in the application process,
Requisition ID: 4753
Nearest Major Market: Rochester
