Top 32 Die attach Jobs in San Jose Ca

Assembly Process Technician
MACOM Technology Solutions Holdings —Morgan Hill, CA
- $52,000 - $81,000 a year
- Full-time
- Mid-level
- High school diploma or GED
- Associate's degree
- Health insurance
- Dental insurance
5d
Associate Process Engineer
PsiQuantum —Milpitas, CA
- $43 - $55 an hour
- Email
- Mid-level
- Analysis skills
- Experience equivalent to degree accepted
Sr Process Engineer
Micross —San Jose, CA
- $100,000 - $119,000 a year
- Full-time
- 5 years
- Analysis skills
- Computer skills
- Health savings account
- Paid holidays
Quick Apply
Principal Packaging Engineer
Skyworks Solutions —San Jose, CA
- $129,400 - $247,800 a year
- Bachelor of Science
- Engineering
- 11+ years
- Employee stock purchase plan
- Health insurance
Principal Package Thermal & Mechanical Engineer
Astera Labs —San Jose, CA
- $185,000 - $230,000 a year
- 8 years
- Doctor of Philosophy
- Mentoring
Assembly Process Technician
M/A Com Technolgy Solutions —Morgan Hill, CA
- $52,000 - $81,000 a year
- Mid-level
- High school diploma or GED
- Associate's degree
- Health insurance
- Dental insurance
8d
Senior Process Engineer
Micross —Milpitas, CA
- $100,180 - $135,000 a year
- Full-time
- Computer literacy
- Engineering
- Assembly
- Health savings account
- Paid holidays
Quick Apply
Hybrid Assembler
RFE —Fremont, CA
- English
- Continuous improvement
- Welding
Manager of Process Engineering
PsiQuantum —Milpitas, CA
- $130,000 - $190,000 a year
- Email
- Analysis skills
- Senior level
- Leadership
Optical Test Engineer, Tech Lead
Astera Labs —San Jose, CA
- System design
- 11+ years
- Doctor of Philosophy
Principal Optoelectronic Packaging Engineer
Samtec, Inc —Santa Clara, CA
- $180,000 - $250,000 a year
- Full-time
- Bachelor of Science
- 11+ years
- Mentoring
- Profit sharing
- Health savings account
IC Package FEA Engineer
Lumilens —San Jose, CA
- Full-time
- 11+ years
- Master's degree
- Doctor of Philosophy
Advanced Package Technology Principal Engineer
Lumilens —San Jose, CA
- Full-time
- 11+ years
- Master's degree
- Doctor of Philosophy
Principal Characterization-Failure Analysis Engineer
PsiQuantum —Milpitas, CA
- $165,000 - $200,000 a year
- Email
- Analysis skills
- Senior level
- Electrical Engineering
Senior Optical Process Engineer
PsiQuantum —Milpitas, CA
- Email
- 5 years
- Analysis skills
- Senior level
Principal Packaging Engineer
Alpha & Omega Semiconductor —Sunnyvale, CA
- $170,000 - $220,000 a year
- Full-time
- Assembly
- In-person
- Manufacturing
Quick Apply
Process Development Engineer
Teledyne Technologies Inc. —Mountain View, CA
- $72,600 - $96,800 a year
- Online Application
- Engineering
- Mid-level
- Analysis skills
- Health insurance
- Paid time off
Technologist, Packaging Engineering
Sandisk —Milpitas, CA
- Full-time
- Computer Science
- 8 years
- Analysis skills
- Health savings account
- AD&D insurance
Quick Apply
R&D Engineering, Director
Synopsys —Sunnyvale, CA
- $230,000 - $344,000 a year
- 11+ years
- Analysis skills
- Mentoring
9d
Sr Expert Operator Semi Assembly
Infineon Technologies AG —Morgan Hill, CA
- $53,400 - $73,500 a year
- Full-time
- Background check
- Pass drug screening
- Mid-level

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Assembly Process Technician

MACOM Technology Solutions Holdings
Morgan Hill, CA

Apply Now

Job Details

Full-time
$52,000 - $81,000 a year
5 days ago

Benefits

Health insurance
Dental insurance
401(k)
RSU
Paid time off
Vision insurance

Qualifications

System troubleshooting
Calibration
Industrial equipment troubleshooting
High school diploma or GED
Scheduled maintenance

Full Job Description

Company Overview:

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication, and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe, and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. https://www.macom.com/. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives, and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

2nd Shift Prototype Assembly Process Engineering Technician

Summary of Role

MACOM is seeking a self-motivated, enthusiastic assembly process technician to join and contribute to our growing prototype line developing breakthrough high power RF devices on our 2nd shift.

Essential Functions:

Program equipment as necessary to ensure product specifications are met as outlined per assembly drawings and travelers.
Run various packaging assembly equipment, including but not limited to die bonder, wire bonders, C-SAM systems, plasma cleaners, ovens, stencil, SMD chip shooter, reflow, Fico molding, lead trimming, and laser marking systems.
Process lots through the assembly line as indicated per travelers, drawings or work instructions.
Perform optical inspections of products to ensure quality requirements are met.
Perform measurements at critical process steps to verify product specifications are passing.
Enter pertinent data into log files or MES system for appropriate lot and data tracking.
Verify quality of products coming off the line meets internal or external customer requirements.
Provide feedback to engineering teams on equipment, product or process issues/improvements.

Qualifications:

High school diploma or equivalent, associated degree in technical field preferred.
Four to eight years in an equipment and/or process technician role with extensive hands on experience.
Knowledge of semiconductor assembly processes including but not limited to die sorting, chip or flip chip die attach, epoxy or solder dispense, wedge or ball wire bond, ultrasonic microscopy, and device sealing or over molding.
Hands on experience with programming and operating die attach and wire bonding equipment.
Capable of troubleshooting equipment, performing scheduled PMs and calibrations.
Experience with assembly of high power RF products preferred.
Demonstrated ability to carry out defined tasks independently with minimum supervision.
Excellent verbal and written communication skills.
Must be available to work 2nd shift but initial training will be during first shift or hybrid shift.

EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email [email protected]. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

ITAR

Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

RSU Eligible

This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOM's discretion, subject to individual and company performance.

Salary Range

The Salary Range for this position is $52,000 - $81,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates' experience, education, and specific knowledge, skills, and abilities.

Benefits: This position offers a comprehensive benefits package including but not limited to:

Health, dental, and vision insurance.

Employer-sponsored 401(k) plan.

Paid time off.

Professional development opportunities.

Apply Now

Refine Your Search

die attach jobs in san jose ca

Assembly Process Technician

Associate Process Engineer

Sr Process Engineer

Principal Packaging Engineer

Principal Package Thermal & Mechanical Engineer

Assembly Process Technician

Senior Process Engineer

Hybrid Assembler

Manager of Process Engineering

Optical Test Engineer, Tech Lead

Principal Optoelectronic Packaging Engineer

IC Package FEA Engineer

Advanced Package Technology Principal Engineer

Principal Characterization-Failure Analysis Engineer

Senior Optical Process Engineer

Principal Packaging Engineer

Process Development Engineer

Technologist, Packaging Engineering

R&D Engineering, Director

Sr Expert Operator Semi Assembly

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