Top 234 Circuit design engineer Jobs in Tempe, Az

PCB & Substrate Layout Engineer (On-Site Preferred)
HRU Tech —Phoenix, AZ
- Contract
- Engineering
- Mentoring
- US work authorization
Quick Apply
Senior Advanced Electrical Engineer
General Dynamics Mission Systems, Inc —Scottsdale, AZ
- $142,696 - $158,303 a year
- Full-time
- Hybrid work
- 6 years
- Management
- Master's degree
- Paid parental leave
- Health insurance
Engineer Electronics Level 3
Northrop Grumman —Gilbert, AZ
- $98,400 - $147,600 a year
- Overtime
- Research
- Mid-level
- Master's degree
- Paid holidays
- Disability insurance
Electrical Engineer 1 or 2 – EGSE
Northrop Grumman —Chandler, AZ
- $65,800 - $118,900 a year
- Overtime
- Customer service
- Engineering
- Windows
- Paid holidays
- Disability insurance
1d
Associate Electrical Engineer / Electronic Design Engineer.
Moog Inc. —Phoenix, AZ
- $75,000 - $105,000 a year
- Full-time
- Analysis skills
- Organizational skills
- In-person
- Employee stock purchase plan
- Paid time off
Design Engineer
onsemi —Scottsdale, AZ
- Online Application
- Master's degree
- Senior level
- Electrical Engineering
Electrical Engineer (Entry-Level)
Corbin Consulting Engineers, Inc. —Tempe, AZ
- Full-time
- Engineering
- Office
- 1 year
- Paid holidays
- Disability insurance
Quick Apply
Analog Design Engineer
STMicroelectronics —Scottsdale, AZ
- $103,400 - $129,300 a year
- Hybrid work
- English
- Mid-level
- Office
MMIC Design Engineer
Viasat, Inc. —Tempe, AZ
- $120,500 - $224,500 a year
- Online Application
- Mid-level
- 3 years
- Master's degree
IC Design Engineer
Desert Microtechnology Associates —Scottsdale, AZ
- Email
- Laboratory experience
- Master's degree
- Bachelor's degree
RF Design Engineer
Crane Aerospace & Electronics —Chandler, AZ
- Full-time
- Background check
- 5 years
- Bachelor of Science
- Paid holidays
- Disability insurance
MMIC Design Engineer
Viasat —Tempe, AZ
- $120,500 - $224,500 a year
- Online Application
- Mid-level
- 3 years
- Master's degree
Entry Level Electrical Engineer
Strategic Mission Critical —Phoenix, AZ
- $45,000 - $150,000 a year
- Full-time
- Microsoft PowerPoint
- Microsoft Word
- Microsoft Excel
- Paid holidays
- Disability insurance
Quick Apply
Analog Design Engineer
Cirrus Logic —Chandler, AZ
- Full-time
- Hybrid work
- Mid-level
- Master's degree
- Analysis skills
Digital Design Engineer
Cirrus Logic —Chandler, AZ
- Full-time
- Hybrid work
- Mid-level
- Master's degree
- Analysis skills
RTL Design Engineer
Broadcom —Chandler, AZ
- $127,100 - $203,400 a year
- Full-time
- Analysis skills
- Fair chance
- Senior level
- Employee stock purchase plan
- Paid holidays
Sr High-Speed SerDes Design Engineer (Remote – USA)
Encore Semi, Inc. —Chandler, AZ
- $135,000 - $165,000 a year
- Full-time
- Remote
- Bachelor of Science
- Doctor of Philosophy
- US work authorization
- AD&D insurance
- Paid holidays
8d
Sr Electronics Design Engineer
ICE (Inter-Coastal Electronics) —Mesa, AZ
- $105,000 - $175,000 a year
- 6 years
- Engineering
- Travel
Quick Apply
10d
Staff Engineer, Design Verification Engineering
Analog Devices —Chandler, AZ
- $172,390 - $199,229 a year
- Online Application
- Master's degree
- Travel
- Senior level
- Work from home
Electrical Engineer
Rosendin —Phoenix, AZ
- $85,200 - $111,900 a year
- Full-time
- Microsoft Outlook
- Construction site
- Engineering
- AD&D insurance
- Paid holidays
Quick Apply

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circuit design engineer jobs near tempe, az

PCB & Substrate Layout Engineer (On-Site Preferred)

HRU Tech -
Phoenix, AZ

Quick Apply

Job Details

Contract

Qualifications

Technical documentation
Testing and evaluation
Electronics design
CAM software
Production validation processes
Schematic diagram drawing
Printed circuit board (PCB) layout
Packaging design
3D modeling
Production documentation
Cross-functional communication

Full Job Description

Principal PCB & Substrate Layout Engineer

Position Overview

We are seeking an experienced Principal PCB & Substrate Layout Engineer to provide technical leadership and hands-on expertise in the design and development of advanced printed circuit boards, high-density substrates, and microelectronic packaging solutions. This role will support complex electronic systems requiring high-speed interfaces, high-density interconnect technologies, and advanced packaging architectures.

The successful candidate will serve as a technical leader, driving layout excellence, supporting multidisciplinary engineering teams, and ensuring designs are optimized for performance, manufacturability, reliability, and quality.

Key Responsibilities

Technical Leadership

Provide technical leadership for PCB and substrate layout activities focused on high-speed interfaces and high-density packaging technologies.
Drive continuous improvement of layout methodologies, design processes, and best practices.
Mentor engineers and layout designers while supporting complex development programs.

PCB & Substrate Design

Lead the design, layout, and analysis of complex electrical and mechanical systems, including:
High-density interposers
Advanced substrates
Multi-layer PCBs
Flip-chip architectures
Digital, analog, power, and RF signal routing
Develop designs utilizing:
High-Density Interconnect (HDI) technologies
Blind and buried vias
Ball Grid Arrays (BGAs)
Differential pair routing
Controlled impedance structures
Design for Test (DFT)
Electromagnetic Compatibility (EMC) principles
Perform stack-up development, impedance calculations, crosstalk analysis, and material selection studies.
Support package material characterization and modeling, including:
Skin effect analysis
Surface roughness considerations
Dielectric constant and loss evaluation
Frequency-dependent material modeling

Manufacturing & Supplier Support

Apply Design for Manufacturing (DFM) principles and ensure layouts align with supplier capabilities.
Develop fabrication documentation and drawings that accurately communicate design intent.
Support fabrication and assembly suppliers throughout the manufacturing process.
Validate manufacturing deliverables using CAM tools and industry best practices.
Review artwork and manufacturing documentation throughout the design lifecycle.

Cross-Functional Collaboration

Participate in design reviews, manufacturing readiness reviews, and technical evaluations.
Support multidisciplinary investigations, feasibility studies, and technology development efforts.
Collaborate with:
Electrical Engineering
Mechanical Engineering
Manufacturing Operations
Quality
Supply Chain
Customers
Suppliers and fabrication partners
Provide technical guidance to internal and external stakeholders throughout product development.

CAD & Documentation Responsibilities

Create and maintain assembly drawings using AutoCAD.
Develop, manage, and maintain DX Designer/CAE component libraries.
Coordinate CAD data and design packages with external PCB layout vendors.
Define and implement CAD methodologies, software applications, and design standards.
Develop automation scripts and utilities to improve engineering tool efficiency.
Ensure fabrication drawings accurately reflect engineering requirements and specifications.
Support footprint development and component library management for PCB design.
Provide schematic support to the Electrical Engineering organization.
Evaluate supplier capabilities and support material, equipment, and service selections.

Required Qualifications

Bachelor's degree in Engineering or equivalent combination of education and experience.
Minimum 10 years of experience in PCB and/or high-density package layout design.
Expert-level experience with Cadence APD+ (Allegro) and associated layout tools.
Experience with APD+ Physical and Electrical Constraint Editor.
Extensive experience designing:
High-Density Interconnect (HDI) structures
Blind and buried micro-vias
Specialty RF dielectric materials
Fine-line routing technologies down to 2m/2m geometries
Experience with advanced packaging technologies including:
2.5D devices
Interposer design
Substrate design
Flip-chip packaging
Die stacking
Package stacking
Substrate stacking
Experience with schematic and netlist-driven layout processes.
Strong understanding of digital, analog, and RF layout methodologies.
Knowledge of electronic packaging technologies and advanced semiconductor packaging concepts.
Experience collaborating with Mechanical Engineering teams on 3D modeling, fit checks, and thermal integration.
Experience using CAM tools for manufacturing validation.
Working knowledge of JEDEC and IPC standards for design, fabrication, and assembly.
Experience creating fabrication packages and assembly documentation.

Preferred Qualifications

Experience with CAM350, Blueprint, or similar manufacturing validation tools.
High-end FPGA package or board design experience.
Experience supporting aerospace, defense, space, telecommunications, semiconductor, or other highly regulated industries.
Familiarity with advanced microelectronics manufacturing processes.
Experience supporting highly reliable or mission-critical electronic systems.

Desired Skills

Strong technical leadership and mentoring capabilities.
Excellent analytical and problem-solving skills.
Ability to evaluate complex technical issues and develop practical solutions.
Strong communication and collaboration skills.
Commitment to quality, execution, and continuous improvement.
Ability to thrive in a fast-paced, multidisciplinary engineering environment.
Systems-thinking mindset with the ability to understand impacts across the full product lifecycle.
Willingness to support team objectives beyond individual areas of expertise.

Additional Requirements

Must be eligible to work in the United States.
Ability to work effectively both independently and within cross-functional teams.

EOE (including Disability/Veterans)

#HRUProfessional

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Refine Your Search

circuit design engineer jobs in tempe, az

PCB & Substrate Layout Engineer (On-Site Preferred)

Senior Advanced Electrical Engineer

Engineer Electronics Level 3

Electrical Engineer 1 or 2 – EGSE

Associate Electrical Engineer / Electronic Design Engineer.

Design Engineer

Electrical Engineer (Entry-Level)

Analog Design Engineer

MMIC Design Engineer

IC Design Engineer

RF Design Engineer

MMIC Design Engineer

Entry Level Electrical Engineer

Analog Design Engineer

Digital Design Engineer

RTL Design Engineer

Sr High-Speed SerDes Design Engineer (Remote – USA)

Sr Electronics Design Engineer

Staff Engineer, Design Verification Engineering

Electrical Engineer

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