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Packaging Module Development Engineer

Intel -
Phoenix, AZ

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Job Details

Full-time
$85,200 - $162,500 a year
8 days ago

Benefits

Health insurance

Qualifications

Bachelor’s degree in mechanical engineering
Master's degree in materials science and engineering
Production data analysis
Chemical Engineering
Bachelor's degree in electrical engineering
Performance testing in mechanical engineering
Mechanical design
Electronics assembly
Customer service
Quality control statistical data analysis
Design of manufacturing processes
Materials engineering within manufacturing
Design of experiments
Bachelor's degree in materials science and engineering
Statistical Process Control
Mechanical Engineering
Industrial equipment adjustment
Engineering process optimization
Reliability analysis
Mid-level
Technical support
Master's degree
Manufacturing facility
Policy & process development
Bachelor’s degree in engineering
Materials Engineering
Continuous improvement
Master's degree in mechanical engineering
Design development
Quality improvement

Full Job Description

Job Details:

Job Description:

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.

Key Responsibilities:

Design and develop assembly processes and equipment to enable future packaging technologies.
Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
Oversee the manufacturability of package designs and manage their manufacturing cycles.
Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.

Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.
Experience listed above should be a combination of the following:
- Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.

Preferred Qualifications

Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.

We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Apply Now

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packaging engineer jobs in tempe, az

Packaging Module Development Engineer

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Packaging Module Development Engineer

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Packaging Module Development Engineer

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