Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
Intel's Chandler, Arizona facility is constructing state-of-the-art fabrication facilities for cutting-edge technology nodes, including Intel 18A and beyond. Additionally, we're developing legacy technologies with foundry partners to launch HVM operations serving global foundry customers.
Position Summary: We are seeking an experienced Staff Process Engineer - Dry Etch - to join our MDCE team and help build a world-class Foundry Customer Engineering organization. This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve our global foundry customer base. The position requires extensive hands-on experience with sub-3nm Gate-All-Around (GAA) FETs and front-end dry etch processing.
Key Responsibilities
Technology Development & Manufacturing
- Drive technology development initiatives that enable both high-volume manufacturing and future technology advancement
- Provide comprehensive process integration and equipment solutions
- Conduct feasibility studies to meet target device specifications
- Lead design and development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design
Process Optimization & Innovation
- Optimize production output for existing products
- Partner with key equipment and materials suppliers to develop enabling technology elements
- Perform process technology feasibility studies using theoretical simulations and practical engineering methods
Industry Leadership & Strategic Vision
- Stay current with industrial process and material manufacturing trends
- Develop insights into future Intel process technology needs
- Partner with vendor ecosystem to build cost-sensitive technology roadmaps
- Influence and drive technical direction across Intel and the broader industry
Technical Leadership & Mentorship
- Develop and mentor technical leaders within the organization
- Act as a change agent while modeling Intel values
- Align organizational goals with technical vision and formulate strategic technical direction
- Demonstrate proven execution in bringing products and technologies to market
Collaboration
- This role involves close collaboration with Logic Technology Development (LTD) and Technology and Foundry Supply Manufacturing (TFSM) teams to support a comprehensive range of applications and customer requirements.
The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Electrical Engineering, Physics, Material Science or in a STEM related field of study
- 4+ years of relevant work experience in the semiconductor industry with a strong focus on dry etch modules .
- Industry experience in one of the areas noted: process development, leadership, semiconductor process, materials.
- Experience working with or for tool suppliers on solution for optimization/customization to meet manufacturing needs especially with the industry leaders in dry etch processes such as LAM, TEL, AMAT, and / or Hitachi.
- Extensive experience in fab with technical track record in any one of the areas of semi-conductor sector such as research and development, yield improvement and / or defect reductions.
Preferred Qualifications
- Advanced degree (MS/PhD) in Electrical Engineering, Physics, Material Science or in a STEM related field of study
- Experience with factory automation control systems
- Direct foundry experience in dry etch process development: FEOL, MOL and/or BEOL.
- Hands-on experience with sub-3nm Gate-All-Around (GAA) FETs
- Demonstrated success in foundry New Product Introduction (NPI) activities and complex tape-out troubleshooting
- Experience in ramp and high-volume manufacturing environments
- Experience with industry standards and certifications
- Experience with device parametric data generation and analysis
- Knowledge of Design of Experiment (DOE) principles and engineering data analysis tools
- Experience in product data interpretation, root cause analysis, and solution development
Why Join Intel MDCE?
Intel offers an exceptional opportunity to work with cutting-edge technology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing.
Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.
Experienced Hire
Shift 1 (United States of America)
US, Oregon, Hillsboro
US, Arizona, Phoenix
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
