Top 10 Quantum chip quantum machine learning Jobs

Physics AI - Thermal-Mechanical Reliability
Flexcompute Inc. —Watertown, MA
- Doctor of Philosophy
- Mentoring
- Recruiting
- Health insurance
- Dental insurance
Quick Apply
Sr. Machine Learning - Compiler Engineer III, AWS Neuron, Annapurna Labs
Annapurna Labs (U.S.) Inc. —Cupertino, CA
- $193,300 - $261,500 a year
- Full-time
- Computer Science
- 5 years
- Research
- AD&D insurance
- Health insurance
Emerging Technology Experts
CRDF Global —Arlington, VA
- Senior level
- Commercial
- Employee assistance program
Senior Software Engineer (Measurement and Bring-up)
Microsoft —Redmond, WA
- $119,800 - $261,000 a year
- Full-time
- Background check
- Azure
- Doctoral degree
Senior Design Automation Engineer, Software, Center for Quantum Computing
Amazon Development Center U.S., Inc. - B02 —San Francisco, CA
- $192,200 - $260,000 a year
- Full-time
- 6 years
- Java
- Master's degree
- AD&D insurance
- Health insurance
Senior Mechanical Engineer, OCS
PsiQuantum —Palo Alto, CA
- $130,000 - $160,000 a year
- Email
- 5 years
- Analysis skills
- Senior level
2d
Faculty Positions
University of Minnesota —Minneapolis, MN
- Full-time
- Background check
- University
- Doctor of Philosophy
Senior Machine Learning Compiler Engineer
Annapurna Labs (U.S.) Inc. —Seattle, WA
- $168,100 - $227,400 a year
- Full-time
- Computer Science
- 5 years
- Research
- AD&D insurance
- Health insurance
Fiber Sensing PostDoc
NOKIA —United States
- Full-time
- Computer Science
- English
- Doctor of Philosophy

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Physics AI - Thermal-Mechanical Reliability
Flexcompute Inc. —Watertown, MA
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Physics AI - Thermal-Mechanical Reliability

Flexcompute Inc.
Watertown, MA

Quick Apply

Job Details

Benefits

Health insurance
Dental insurance
401(k)
Vision insurance
Gym membership

Qualifications

AI models
Research project technical leadership
Machine intelligence
Doctor of Philosophy
Solid mechanics
AI implementation
Simulation tools
Machine learning (ML) fundamentals
Design for reliability (DFR)

Full Job Description

Flexcompute is a cutting-edge technology startup that specializes in ultra-fast simulation technology. Our products are utilized by companies in designing and optimizing technology products, with applications ranging from designing airplanes and cars to wind turbines and quantum computing chips. Our customer base includes both household names and startups in emerging industries. Our company was founded by world-renowned leaders in simulation technology from Stanford University and MIT. Backed by top VC firms, we are poised to disrupt the billion-dollar engineering simulation industry with our fast-growing trajectory

Our core technology features the world’s fastest GPU solvers, capable of delivering orders-of-magnitude speedups over traditional tools. By integrating these solvers with our Physics AI Foundation Models, we enable engineers to explore design spaces that were previously computationally inaccessible. At Flexcompute, we don’t just make simulations faster; we make the “impossible” solvable, helping our partners tackle the most critical challenges in 3D-IC design, aerospace, and beyond.

Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability. In this role, you will be the primary architect of how we apply our world’s fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry’s most critical bottleneck: the structural and thermal integrity of advanced packaging.

You will lead the strategy for solving high-stakes issues such as warpage, CTE mismatch, and thermal-induced stress in 3D-ICs and chiplet architectures. You aren’t just using tools; you are defining the future of how AI and high-performance computing (HPC) converge to make 3D chips viable at scale.

Requirements

Education: PhD in Mechanical Engineering, Materials Science, Physics, or a related field with a deep specialization in computational multi-physics.
Subject Matter Authority: Recognized expertise in 3D-IC reliability, with a profound understanding of the mechanics of warpage, interfacial delamination, and thermal-mechanical coupling in heterogeneous integration.
AI/Simulation Fluent: A strong perspective on the role of GPU acceleration and Machine Learning in scientific computing.
Industry Track Record: 10+ years of experience in the semiconductor or microelectronics industry, having led technical projects that directly impacted product reliability or time-to-market.

Responsibilities

Strategic Leadership: Own the technical roadmap for the thermal-mechanical domain. Define how our Physics AI accelerates traditional FEA/multi-physics workflows to provide real-time reliability insights.
Architectural Innovation: Design end-to-end simulation workflows that address complex 3D-IC challenges, including through-silicon via (TSV) stress, micro-bump reliability, and global package warpage.
High-Stakes Collaboration: Act as the lead technical partner for world-class semiconductor companies, demonstrating how Flexcompute’s speed transforms their iterative design cycles from days to minutes.
Product Influence: Directly influence the development of our GPU-accelerated solvers, ensuring they are optimized for the non-linear material behaviors and multi-scale meshes required for advanced packaging.
Team Building: Recruit, mentor, and lead a high-performing team of engineers specialized in computational mechanics and AI-driven physics.

Benefits

Competitive compensation with equity of a fast-growing startup.
Medical, dental, and vision health insurance.
401(k) Contribution.
Gym allowance.
Friendly, thoughtful, and intelligent coworkers.

Quick Apply

Refine Your Search

quantum chip quantum machine learning jobs

Physics AI - Thermal-Mechanical Reliability

Sr. Machine Learning - Compiler Engineer III, AWS Neuron, Annapurna Labs

Emerging Technology Experts

Senior Software Engineer (Measurement and Bring-up)

Senior Design Automation Engineer, Software, Center for Quantum Computing

Senior Mechanical Engineer, OCS

Faculty Positions

Senior Machine Learning Compiler Engineer

Fiber Sensing PostDoc

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