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Senior Advanced Microelectronics & Semiconductor Grant Writer - Remote

BW&CO
Remote

Quick Apply

Job Details

Part-time | Full-time | Contract
Up to $140,000 a year

Benefits

Health insurance
Dental insurance
401(k)
Paid time off
Vision insurance
Flexible schedule
Referral program

Qualifications

Technical editing
Teamwork
Content creation for technical audiences
Research proposal writing
DoD experience
Master's degree
Attention to detail
Securing grant project budgets
Electrical Engineering
Technical writing experience within technology

Full Job Description

Company:
BW&CO is a dynamic consulting firm where expertise meets impact—we help biotech startups and deep-tech companies secure millions in federal funding. Join a team where precision matters, every project is unique, and your expertise helps transform innovative research ideas into funded realities.

Job Summary
We are seeking an experienced Technical Grant Writer with specific expertise in advanced microelectronics, semiconductor packaging, and hardware-driven R&D projects. This role is ideal for a writer who understands both the technical depth of advanced packaging systems — including 2.5D/3D integration, heterogeneous integration, wafer-level packaging, and domestic semiconductor manufacturing — and the strategic requirements of federal R&D funding programs (e.g., DoD OTAs, SBIR/STTR, Army/DEVCOM solicitations).

The ideal candidate has a proven record of winning competitive grants and can translate complex hardware and semiconductor concepts into compelling, compliant, and persuasive proposal narratives.

Key Responsibilities

Grant Proposal Development

Research, write, and submit high-quality federal R&D grant proposals for advanced microelectronics, semiconductor packaging, and hardware-centric projects
Develop complete proposal packages aligned with solicitation requirements and evaluation criteria

Technical & Scientific Writing

Translate complex semiconductor packaging technologies — including silicon interposers, fan-out wafer-level packaging (FO-WLP), 2.5D/3D advanced system integration, through-silicon vias (TSVs), heterogeneous integration, and RF packaging — into clear, compelling narratives
Articulate technical merit, innovation, feasibility, and commercialization potential

Collaboration & Client Engagement

Work closely with clients, subject-matter experts, and internal project managers to gather technical inputs
Ensure technical accuracy, narrative consistency, and strategic alignment across proposal sections

Required Qualifications

Education

Master's degree required
PhD strongly preferred (Electrical Engineering, Materials Science, Semiconductor Engineering, or related technical field)

Experience

4+ years of professional scientific or technical grant writing experience
Demonstrated success securing federal funding for hardware, semiconductor, or advanced manufacturing R&D projects

Technical Expertise

Strong understanding of:
Advanced semiconductor packaging technologies (2.5D/3D integration, FO-WLP, silicon/glass/SiC interposers, hybrid bonding, high-density interconnects)
Semiconductor manufacturing processes and supply chain ecosystems
Federal R&D grant and OTA requirements (e.g., DoD SBIR/STTR, Army CIR/OTA solicitations)

Writing & Research Skills

Exceptional technical writing and editing abilities
Proven ability to clearly communicate complex technical concepts to non-technical reviewers
Skilled at identifying relevant funding opportunities and aligning proposals to agency priorities

Professional Skills

Excellent communication and collaboration skills
Strong attention to detail and organizational ability
Ability to manage multiple proposals, deadlines, and client engagements simultaneously

Preferred Qualifications

Experience writing grants for advanced packaging, microelectronics, or defense-industrial base programs
Familiarity with DoD OTA mechanisms, DEVCOM/Army solicitations, and domestic manufacturing resiliency initiatives
Knowledge of federal funding agencies' review processes and best practices
Track record of winning large or highly competitive hardware/semiconductor-focused grants

Compensation & Benefits

Pay: Up to $140,000/year, commensurate with experience and education
Bonuses: Clear bonus structure for winning grants and participation in internal projects
Benefits: Flexible schedule, Medical, Vision, and Dental Insurance, 401(k)
Schedule: Monday–Friday, part-time, project based - we are flexible

Pay: Up to $140,000.00 per year

Benefits:

401(k)
Dental insurance
Flexible schedule
Health insurance
Paid time off
Referral program
Vision insurance

Work Location: Remote

Quick Apply

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