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R&D Thermal/Mechanical Engineer – ATE Interface Hardware

DIS Tech -
Remote

Quick Apply

Job Details

Full-time
$120,000 - $150,000 a year

Benefits

Health insurance
Dental insurance
401(k)
Paid time off
401(k) matching
Life insurance
Retirement plan

Qualifications

Fluid dynamics
Machine design
Bachelor of Science
CAD design (engineering design task)
GD&T
Bachelor's degree
ANSYS
Design engineering
FEA
Simulation tools

Full Job Description

Title:

R&D Thermal/Mechanical Engineer – ATE Interface Hardware

Location: Remote

About DIS Tech: DIS Tech America, a business branch of Technoprobe S.p.A., is a global leader in the design and manufacture of complex device interface boards for semiconductor automated test equipment (ATE). With over 20 years of experience and a vertically integrated manufacturing model, DIS Tech delivers high-performance load boards, probe card interfaces, and prober interface boards that enable reliable wafer and final test operations. The company specializes in advanced multilayer PCB solutions engineered for high pin counts, high frequencies, and demanding power and thermal requirements, supporting both new product introductions and high-volume semiconductor manufacturing

Job Summary:

The R&D Thermal/Mechanical Engineer leads thermal analysis, modeling, and mitigation strategies for high-performance semiconductor ATE interface hardware (load boards, probe cards, interposers), while also contributing to the mechanical design, structural integrity, and reliability of these platforms. Thermal performance is the primary focus of the role; mechanical responsibilities — including stiffening, flatness, warpage control, and tolerance stack-ups — are a meaningful secondary scope rather than an afterthought. The position supports the development and qualification of advanced multilayer PCB platforms operating at high power densities and high frequencies, and works closely with R&D, PCB design, signal/power integrity, materials, quality, and manufacturing teams to deliver robust, manufacturable, and scalable solutions.

Key Responsibilities:

Perform CFD and FEA thermal simulations on high-layer-count ATE PCBs and interface assemblies.
Model heat dissipation paths, copper balancing effects, and via thermal performance.
Analyze high-current regions and localized hot spots in mixed-signal and high-speed boards.
Correlate simulation results with lab thermal testing and empirical data.
Support development of next-generation stack-ups for high-power ATE applications.
Define thermal qualification criteria and reliability validation plans.
Develop thermal design guidelines and internal documentation.
Design mechanical support structures and stiffening systems for large-format ATE PCBs.
Perform structural FEA for deflection, flatness, and stability under thermal and electrical loading.
Analyze warpage during reflow, thermal cycling, and operational loading.
Conduct tolerance stack-up analysis for connectors and test interfaces.
Support root-cause analysis of mechanical failures and reliability escapes.
Contribute to mechanical design standards and documentation.
Support NPI programs and R&D-to-manufacturing transitions for advanced ATE interfaces.
Collaborate closely with PCB layout, SI/PI, materials, quality, and manufacturing engineering teams.

Required Qualifications:

BS or MS in Mechanical Engineering or a closely related discipline.
5+ years of experience in electronics thermal and/or mechanical design.
Strong proficiency in CFD/thermal tools (ANSYS Icepak, Fluent, COMSOL, or equivalent).
Working proficiency in SolidWorks or an equivalent CAD platform, including GD&T and tolerance stack-ups.
Exposure to multilayer PCB design, stack-ups, or fabrication constraints, direct experience not required, but candidates should be comfortable learning the domain quickly.
Strong analytical and root-cause problem-solving skills.

Preferred Qualifications

Experience with semiconductor test environments (wafer sort, final test, ATE systems).
Direct experience with ATE interface hardware (load boards, probe cards, interposers).
Experience with high-speed/high-power PCB stack-ups.
Background in reliability testing, thermal cycling, and mechanical qualification.
Experience transitioning R&D designs and platforms into volume production.

Job Type: Full-time

Pay: $120,000.00 - $150,000.00 per year

Benefits:

401(k)
401(k) matching
Dental insurance
Health insurance
Life insurance
Paid time off
Retirement plan

Work Location: Remote

Quick Apply

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